環烯烴聚合物基板表面氧電漿改質

Surface modification of COC substrate by oxygen plasma treatment

蘇志仁(Jr-Ren Shu)

指導教授 ： 游信和

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2006年)

https://doi.org/10.6827/NFU.2006.00012

摘要

本論文主要是對軟性電子基板表面以氧電漿(oxygen plasma)處理方
式進行改質，以提高基板表面和鍍膜間之附著力。基板材質選用環烯烴
聚合物(Cyclic olefin copolymer, COC)。基板表面經不同電漿功率及不同
改質時間處理後的元素成份及化學鍵結變化，可由電子能譜儀(X-ray
Photoelectron Spectrometer；XPS)分析。我們發現隨著電漿處理時間及功
率的增強，氧原子含量會有增加的趨勢。而藉由對電子能譜之C1s 及O1s
進行圖譜分峰發現基板表面確實導入了C-O 及C=O 親水性官能基。表
面能的提高及官能基的形成，是增強基板和鍍膜附著力的主要因素。

關鍵字

電漿處理接觸角 ； 環烯烴聚合物 ； 電子能譜儀

並列摘要

The surface of flexible electronic substrate was modified by oxygen
plasma treatment. COC (cyclic olefin copolymer) was used to be the substrate
in this study. The atomic components and chemical structure of the COC
substrates modified by different plasma powers and times were examined by
XPS (X-ray Photoelectron Spectrometer). The oxygen ratio of modified
surface was depended on the plasma power and modified times. After peak
fitting the C1s and O1s of XPS spectra, the C-O, C=O hydrophilic functional
groups were created on the surface of COC substrate. The interface adhesion
between COC substrate and coating layers was enhanced primarily due to the
hydrophilic functional groups formation and surface free energy increasing.

並列關鍵字

Plasma Treatment ； Contact Angle ； Cyclic Olefin Copolymer ； X-ray Photoelectron Spectrometer

參考文獻

1. R. R. Lamonte, D. McNally, Uses and processing of cyclic olefin

copolymers(COC), Plastic Engineering, 56 (2000) 51-59.

2. A. P. Pijpers, Robert J. Meier, Adhesion behaviour of polypropylenes after

flame treatment determined by XPS(ESCA) spectral analysis, Journal of

Electron Spectroscopy and Related Phenomena, 121 (2001) 299-313.