原子級模擬與實驗研究多層奈米薄膜之力學特性分析

Mechanical Characterization Analysis of Multilayer Nanofilms Atomistic Simulations and Experimental Studies

吳佳鴻(Jia-hung Wu)

國立虎尾科技大學/工程學院/機械與機電工程研究所/碩士(2007年)

摘要

本研究運用分子動力學來研究在鋁、鎳和鋁/鎳多層薄膜下之壓痕變形、接觸和黏著效應與刮痕變形、應力與切屑的形成。模擬的結果發現，當壓痕的深度增加時，其最大的負載力與黏著也隨之增加。原子跳躍的現象發生在一開始的壓痕過程中，而鬆弛力和黏著現象則發生在持壓和提針的過程。而在刮痕過程中，會產生黏著-滑移與加工硬化的現象。當刮痕的深度增加時，其塑性能與黏著也隨之增加。界面的滑移帶都在｛111｝〈110〉的系統上。且滑移帶的最大寬度約為1 nm。最後將實驗與模擬結果做比較分析，來探討多層膜機械性質之特性。

並列摘要

In this study molecular dynamics (MD) simulations were carried out to study the effects of indention deformation, contact and adhesion and plastic deformation, stress and chip formation of scratched on Al, Ni and Al/Ni multilayered films. The results showed that when the indention depth of the sample increased, the maximum load and the adhesion were increased. The jump-contact behavior occurred at the beginning of the loading process. The force relaxation and the adhesion took place at the holding depth and unloading process, respectively. The stick-slip and work-hardening behavior were observed during scratching process. Both the plastic energy and the adhesion increased with an increase in the scratching depth. The glide bands of the glide bands were about 1 nm. As well, the MD results will be compared with the experimental results.

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