- 學位論文
IC晶片表面黏著載帶快速成型機之系統整合分析
System combination and Analyse of IC Carrier Tape Machine
摘要
當晶片生產時，為了避免在運送中晶片相互刮傷彼此，或者因為與空氣、水氣接觸產生氧化的現象而造成品質不良，所以晶片必須經過包裝，將外界的干擾源作隔絕，透過塑膠載帶之表面黏著元件包裝（SMC）以改善上述的問題。 本文主要是探討一載帶成型機在設計規格方面的可靠度問題。在強度與應力之機率密度函數均為常態分佈時，對系統的零件設計規格方面的問題進行探討，進而計算其系統可靠度。並針對塑膠載帶押出成型製程參數最佳化之研究。由於載帶每次成型270個，成型尺寸為1.35㎜X2.25㎜X1.35㎜，極難達成公差標準。故本研究，模具尺寸透過實際測試探討押出機螺桿馬達轉速與成型模具轉速對載帶成品之影響、成型模具的負壓大小對載帶成品之影響、以及成型模具的模溫對載帶成品之影響，經由實驗以分析出一最佳化製程。 本研究之量測系統利用CCD擷取影像，配合四軸平台移動，以模擬載帶於生產線上之檢測。在影像處理中使用之方法有:影像旋轉、影像定位、殘影處理、樣本比對。故由本系統之簡易介面，可執行準確載帶尺寸之量測動作。結合平台的移動速度、移動距離、及影像處理系統，做最佳之系統整合。經本研究實驗驗證，其準確度及穩定度皆在98%以上。
關鍵字
無資料並列摘要
In order to avoid the chips scrape each other during transportation, and chips contact with water or air will cause oxidization result in poor quality of products. The chips need well packing to isolate outside interference sources. The Surface Mount Component (SMC) packing by plastic carry tape can improve the above-mentioned problems. This study focuses on the reliability question in designing of carry tape machine.When the function of density of probability of the intensity and stress is distributed for the normality, carry on the discussion to the question of designing the specification of part of the system, and then calculate its systematic reliability. This study focuses on the extrusion process parameters optimization for plastic carry tape. Because each extrusion process produces 270 pieces of carry tapes, the tape size is 1.35㎜X2.25㎜X1.35㎜. It is extremely difficult to reach the tolerance standard. Therefore, this study utilize practical test to explore various effects for quality of the carry tape, such as the rotational speed of extruder screw motor and extrusion mold, the negative pressure of extrusion mold, and the temperature of the extrusion mold. These experiments could analyze an optimal extrusion process. The vision inspection system uses CCD to capture the image, and four axle table to move the parts. It can simulate on-line carry tape inspection. The image treatment has many methods such as image rotation, image positioning, ghost image treatment, pattern match and contour searching. This paper combines the X-Y platform with an image treatment system to establish an optimal vision integration system for carry tape inspection. This system was verified via practical comparison of specimens and parts, with a stability and reliability of more than 98 per cent.