雷射照相裝置之研究

Study of Laser Device for Photograph

葉文富(Wen-Fu Yeh)

指導教授 ： 李廣齊

國立虎尾科技大學/工程學院/自動化工程研究所/碩士(2012年)

摘要

本文針對雷射雕刻機發展一照相雕刻系統，利用嵌入式系統其即時和多工操作之特性，使系統設計趨於小型化。本文使用一ARM核心之嵌入式開發板，並配置一解析度130萬畫素之攝像頭，用以即時獲取影像資料，並轉換成bmp之檔案格式儲存於控制器內，接著利用影像處理技術，將儲存之圖檔資料作灰階轉換、反白處理、縮小灰階變化及灰階分佈均衡化等處理，並將處理後之影像二值化分層輸出，採用定功率之方式逐層雕刻影像，完成雷射雕刻照相之2.5D加工。此外，本文並配合雷射雕刻照相系統製作一雕刻夾具，此夾具可夾持圓形、方形、矩形和橢圓形等工件，且可根據工件大小改變其夾頭固定位置。夾具於使用前須先固定於雷射雕刻機之加工平台上，省略每次加工前固定工件擺放位置之時間，達到操作方便及快速固定之要求，並提高加工效率。

關鍵字

雷射照相 ； 影像處理 ； 嵌入式系統

並列摘要

The development of a photographic engraving system for laser engraving machine, the use of embedded system features real-time multitasking operating system design tends to miniaturization. This article uses an ARM core embedded development board, and configure a resolution 1.3 million pixel camera for instant access to image data, and convert the files of bmp format stored in the controller. Then, the image processing technology, the stored image data for grayscale conversion, anti- white handle, narrow gray-scale change, and the gray level distribution and equalization processing, image binarization and treatment stratification output to adopt fixed power manner drill carved images, and complete laser engraving photographic 2.5D machining. In addition, with the laser engraving camera system to make a sculpture fixture this fixture clamping of round, square, rectangular and oval work piece chuck fixed position, and can be changed according to the work piece size. The fixture must first fixed before use in the processing platform of the laser engraving machine, omitting each processing fixed work piece before the time of placement to achieve easy operation and fast fixed requirements, and improve processing efficiency.

並列關鍵字

Laser photograph ； Image processing ； Embedded system

參考文獻

[2]Yilbas B.S., “Experimental investigation into CO2 laser cutting parameters,” Journal of Materials Processing Technology, Vol. 58, pp.323-330, 1996.

[3]Wang C. & Zeng X.Y., “Study of laser carving three-dimensional structures on ceramics: Quality controlling and mechanisms”, optics and laser technology, pp.1400-1405, OCT 2007.

[4]Zhou B.H. & Mahdavian S.M., “Experimental and theoretical analyses of cutting nonmetallic materials by low power CO2-laser”, journal of materials processing technology, pp.188-192, FEB 28 2004.

[6]Tsai C.H., Chen C.J., “Application of iterative path revision technique for laser cutting with controlled fracture”, optics and lasers in engineering, pp.189-204, JAN 2004.

[8]王伯勳，“眼鏡鏡片雷射切割之研究”， 國立虎尾科技大學機械與電機工程研究所碩士論文，臺灣， 2009。