- 學位論文
微通道致冷器應用於LED模組之散熱研究
Applying microchannel cooler to study the heat dissipation of the LED module
摘要
過去採用氣體燈如氙燈、汞燈等作為UV膠的固化燈具，近年來高功率LED UV燈的工業應用越來越多，此時燈具的散熱更顯重要。本研究係採用微通道致冷器(Microchannel cooler, MCC)來冷卻UV LED模組，其中需要考慮到MCC材料與LED支架的熱膨脹係數差異，因此我們改變尺寸以及改變微通道的材料來做應力匹配，研究中採用Solidworks 3D設計出基本的多層圖案，使用雷射切割機將金屬板或銅板切出多層圖案，在板上呈現出水道的走向，接著使用電鍍以及熱蒸鍍製作金屬接合薄膜，再使用熱壓合技術讓金屬薄膜達到共晶接合，之後將UV LED晶粒陣列經固晶、打線之後，再將一石英玻璃上蓋封合成一UV LED模組，此一LED模組設計將超過100瓦，應用上需組裝大約15個模組併聯，約1500瓦的工業級UVLED固化燈。
並列摘要
In the past, the use of gas lamps for example xenon lamp, mercury lamp and other curing lamps as UV curing light, in recent years, high-power LED UV lamp industrial applications more, lighting cooling is much more important at this moment. In this study, a microchannel cooler (MCC) was used to cool the UV LED module,Which We had to take into account the MCC materials and LED thermal expansion coefficient of the difference, So we change the size and change the material of the microchannel to do the stress matching. In the study, Solidworks 3D was used to design the basic multilayer pattern, Using a laser beam cutting machine to generate the metal plate or copper multi-layer pattern, In the metal plate to appear the direction of the waterway, Then using the plating and the production of metal-bonding film by thermal evaporation, And then use the thermocompression bonding technology allows the metal film to reach the eutectic bonding, After the UV LED grain array through the die bond and wire, Then a quartz glass cover a UV LED module to form a module, This LED module design will be more than 100 watts, Application on the need to assemble about 15 modules in parallel, About 1500 watts of industrial grade UVLED curing lamp.