晶片切割專用紫外光硬化可剝離膠帶之研製

The Fabrication of UV-Curing Peel-Off Dicing Tape

施文權(Wen-Chuan Shih)

指導教授 ： 莊賦祥

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2013年)

摘要

藉由(1)感壓膠產品化學組成與玻璃轉移溫度分析、(2)感壓膠與寡聚物配方設計與 UV接著力評估、(3)起始劑篩選與 UV硬化速率評估，開發出可 UV硬化之晶片切割專用黏貼膠帶(Dicing tape)。感壓膠與寡聚物之相容性會影響殘膠多寡，相容性越高的組合則殘膠越少。添加單體與交聯劑之含量皆可提升UV 前後之接著強度比值，但交聯劑效果較佳。PSA3 – Oligomer5 較 PSA3 – Oligomer3 有更佳的相容性，可獲得較好的接著強度比值。UV照射後要達到很低的黏著力，寡聚物的篩選非常重要，以高官能基(大於 2)且分子量小於10000 較佳。由本實驗可得以配方T17 之比例可達到最佳接著強度比值。光起始劑的種類與含量會影響oligomer的的聚合程度，聚合反應越完全應會得到最佳的接著強度比值。運用Photo-DSC來測量光固化反應程度可得知以光起始劑組合(B、C、D)為最佳，放熱達到113 J/g。從DSC實驗數據得知PSA在光固化反應中並無參與反應，主要的反應機制是寡聚物、單體與交聯劑聚合產生鍵結抑制PSA的投錨效應，最終造成切割膠帶的黏性下降。此研發計畫的成果不但提升國內產業的競爭力，也提升國內基礎材料的自主率。

關鍵字

感壓膠 ； 寡聚物 ； 高官能基 ； 投錨效應 ； 接著強度

並列摘要

By (1)the analysis of chemical composition and glass transition temperature of pressure sensitive adhesive products, (2)the formulation design and UV adhesion assessment of pressure sensitive adhesive and oligomer, (3)to serve initiators and to assess UV adhesion hardening rate, this study develops UV curable adhesive tape (Dicing tape) dedicated for wafer dicing. Compatibility of pressure sensitive adhesive and oligomer induced residue significantly after tape was peer and the phenomenon of the residue reduces with satisfying compatibility of pressure adhesive and oligomer. The ratio of peer strength of dicing tape increased with extending amount of monomer and crosslinker, but crosslinker contributed to ration of peer strength dramatically. The experiment revealed that PSA3-oligomer was more compatible to PSA3-oligomer3 and dicing tape which was made by PSA3-oligomer showed superior ratio of peer strength. The reduction of adhesion after UV curing is due to the UV polymerization oligomer which degraded to a very low adhesion. So the serve of the oligomers is very important. A high functional group (greater than 2) and a molecular weight less than 10000 are better. The photointiator1 is better. Using T17's formula, the goal of this study was achieved. The species and amount of photo-initiator affected the degree of the polymerization reaction substantially and exhaustive polymerization reaction generated marvelous ratio of peer strength. Measuring the degree of UV-curing reaction by Photo-DSC, the reaction of the formula of photo-initiator (B, C and D) was improved and heat of reaction was up to 113 J/g. DSC data reveled that PSA did not participate in the UV-curing reaction. The mechanism of UV-curing reaction of dicing tape was that polymerization of oligomer, monomer and crosslinker formatted new chemical bond to restrain anchorage of pressure sensitive adhesive, which restricted the peer strength of the dicing tape. The results of this research will not only enhance the competitiveness of the domestic industry, but also enhance the domestic independence of the basic materials.

並列關鍵字

Pressure Sensitive Adhesive ； oligomer ； High functional Group ； Anchorage ； Peer Strength

參考文獻

15. Nai-We Chang, “The Principle and Practice of Adhesion”, Xin Ming Publishing Inc.,Taipei, 1972

18. D. Satas, “Handbook of Pressure-Sensitive Adhesive Technolo-gy”, 2 nd ed., Van Nostrand Reinhold Company, NY, 1989

20. 劉慶良, “丙烯酸系感壓膠用於光學薄膜配方及其耐候表現之研究”, 國立台北科技大學,台北,2009.07.

21. Czech Z. Crosslinking of acrylic PSA, Ed. TU Szczecin,1999.

參考文獻