摘要
目前LED業界之PLCC(塑膠導線架承載晶片)LED 為不耐吸濕特性，臺灣一般環境之濕度約為50%在此濕度 LED打件廠在拆開包裝後使用即開始有吸濕情形，會造成在打件後高溫?焊時會有LED內部濕氣瞬間因高溫造成封裝膠材與導線架瞬間產生間隙，連帶的將黏著LED晶粒之銀膠與LED導線架產生剝離間隙造成開路而形成LED無法點亮，因此在LED SMT打件廠對於環境濕度的控制與拆封後溼度之管控格外重要。 本論文針對PLCC產品，從無法點亮之成品物理現象確認，研究修改晶片銀膠與導線架黏著方式及金線與支架之黏著力，並將修改後之LED在高溫高濕環境後再模擬SMT打件廠之高溫迴焊條件測試LED是否仍然能正常點亮，確認LED不會因為濕氣滲入後經高溫迴焊造成斷路現象， 比一般業界之LED更能抗吸濕，讓打件廠商在使用上更方便。 由實驗結果得到證明，透過修改製程後.LED在90%之濕氣中40小時後過高溫迴焊三次持續測試7回合仍不會有不亮的情形，證明已提昇抗潮能力，大大的提昇產品質也讓LED打件廠在使用上，比一般業界生產之LED更能方便使用。
並列摘要
Currently in the LED industry, the PLCC (Plastic Lead Frame Chip Carrier) LED device is intolerant of hygroscopic properties, and due to the climate and humidity conditions in Taiwan is about 50%, so after unpacking the LED in SMT factory, LED began to absorb the moisture and cause the LED no light which is coming from the peeling between the leadframe and silver paste in high temperature reflow process to generate the gap. This gap makes the LED “Open” circuit and no light. Therefore, it is very important for LED SMT factory to control the environment humidity after unpacking. In this paper for PLCC LED product, by studying the no light physical phenomena of LED device to modify the adhesion of chip and leadframe, also the bonding of wire and leadframe, then simulate the high temperature and humidity condition of reflow, to ensure LED still can be light up or not, hence to verify and confirm the moisture will not penetrate into the LED device to cause the open circuit issue. It will improve the anti-moisture to help the SMT factory to have more secure LED device. The experimental results prove that, through the modification of production process, LED device at 90% humidity moisture absorption after 40 hours, and three times continuous high temperature reflow condition to test seven rounds still light up, this has been proven to improve moisture resistance capability, greatly improve product quality, also allows the use of LED SMT plant in more secure product to use than other LED manufacture.