軟性塑膠導電鍍層之製作及其殘留應力分析

Preparation of Flexible Conductive Coating Layer and Its Residual Stress Analysis

黃思淳(Szu-Chun Huang)

指導教授 ： 游信和

共同指導教授 ： 郭文凱(Wen-Kai Guo)

國立虎尾科技大學/電機資訊學院/光電與材料科技研究所/碩士(2011年)

摘要

本研究主要以熱壓方式製備聚芳酯(Polyarylate, PAR)基板，再以化
學原位聚合法及噴塗法在PAR 基板上沉積一層PPy 或SWCNTs 導電
層，隨後以熱滲透法將鍍層滲入基板表層，藉由雙層及三層結構模型
之建立，探討不同熱滲透溫度及時間，對滲透層之厚度及鍍層殘留應
力影響。

關鍵字

PAR ； PPy ； SWCNTs ； 熱滲透 ； 殘留應力

並列摘要

Polyarylate (PAR) substrate was prepared by hot pressing first, and then
two dirrerent conductive layers polypyrrole (PPy) and single wall carbon
nanotubes (SWCNTs) were coated on its surface by chemical in-situ
polymerization and low temperature spraying, separatively. The
relationship between the thickness and residual stress of conductive layers
were evaluated by a triple layers model.

並列關鍵字

PAR ； PPy ； SWCNTs ； thermo permeating ； residual stress

參考文獻

[9] 可撓式塑膠基板拓展新應用領域，光連雙月刊 37 期2002 年1 月p. 52.

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