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  • 學位論文

應用於矽光學平台製作之電磁微致動器開發

The Development of Electromagnetic Micro-actuator for SiOB Fabrication

指導教授 : 鄭裕庭

摘要


光纖技術已逐漸應用於許多 光通訊模組當中,做為機殼內電路板或元件之間的資料傳輸媒介。其中,矽光學平台即基於半導體微機電製程之光學元件架構,其體積小、低功率消耗以及通道數容易擴充等特性, 已廣泛應用於多通道且短距離資料傳輸之消費性電子產品當中。然而隨著元件尺寸逐年縮減,光學精準度要求越趨嚴格,故本研究將透過微機電技術,開發應用於光學透鏡校準之微型致動器。其工作原理為利用電磁作力產生三軸位移與角度調變,讓載台進行微米等級之操控。本致動器可進行2μm內的線性水平位移及10.5μm內的線性垂直位移,並可進行 內的線性垂直位移,並可進行1度內的傾斜角度調變。此外,由於機械彈簧結構之線性特可使電磁力所造成的載台位移改變量穩定動,使光纖對接之操作難度降低,提升光學透鏡校準良率。本論文成功完致動元件製造,並驗證元件實際量測數據與模擬所得數據有相符趨勢與在光學 平台製作應用上的可行性。

並列摘要


In recent years, fiber optic technology has been extensively employed in lots of electronic products for signal communication. In the technology, Silicon Optical bench (SiOB), an optical device with the characteristics of small size, low power consumption, and expandable channel numbers realized using the state-of-the-art semiconductor process, is developed for multi-channel, short distance, and high data rate communication between optical communication module. As the transmission rate up to 100Gbps, the optical accuracy requirement becomes more and more strict, which makes the SiOB fabrication more challenge. In this thesis, an alignment scheme is proposed for SiOB fabrication using an electromagnetic force-driven microactuator. The actuator comprises four sets of corrugated springs and microcoils driven by with Lorentz and reluctant force respectively and can accomplish a linearly horizontal displacement range within 2μm, linearly vertical displacement range within 10.5μm, and tilt angle within 1o for positioning optical lens with highly accurate alignment (0.5

參考文獻


[1] Osenbach, J. W., et al. "Low cost/high volume laser modules using silicon optical bench technology." Electronic Components & Technology Conference, 1998. 48th IEEE. IEEE, 1998.
[2] Silicon Optical Benches. (n.d.). Retrieved February 2, 2017, from Micralyne, Inc:http://www.micralyne.com/applications/optical-mems/silicon-optical-benches/
[3] Duan, Can, et al. "A 45-tilted 2-axis scanning micromirror integrated on a silicon optical bench for 3D endoscopic optical imaging." Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on. IEEE, 2015.
[4] Lo, Jeffery CC, et al. "Chip-on-chip 3D optical interconnect with passive alignment." Electronic Components and Technology Conference, 2004. Proceedings. 54th. Vol. 2. IEEE, 2004.
[5] Kim, Jin Tae, Keun Byoung Yoon, and Choon-Gi Choi. "Passive alignment method of polymer PLC devices by using a hot embossing technique." IEEE Photonics Technology Letters 16.7 (2004): 1664-1666.

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