本實驗以異佛爾酮二異氰酸酯(IPDI)與甲基丙烯酸羥乙酯(HEMA)進行單端反應,以樹枝狀聚酯多元醇(H2004)為主原料,搭配不同長鏈分子量聚醚多元醇,最後加入活性稀釋劑稀釋黏度。我們利用樹枝狀聚合物及長鏈聚合物的特性,製得具有低收縮率、低黏度及有延展性等性質之3D列印光固化材料。利用傅立葉轉換紅外線光譜儀(FTIR)及甲苯—二正丁胺滴定法確認反應中止點,並藉由TGA、拉力試驗、黏度測試、邵式硬度及收縮率進行探討與分析不同重量百分比之預聚物與稀釋單體在光固化後的性質。 實驗結果顯示,樹枝狀聚合物含量越高,越能有效減少固化後造成的形變量,而添加長鏈聚合物可彌補樹狀聚合物太過硬脆之性質,此研究成果使得3D列印光固化材料在應用上更有廣泛性。
3D printing photosensitive resin was synthesized by varying different mass percentage of isophorone diisocyanate (IPDI), hydroxyethyl methacrylate, dendritic polyester polyol (H2004) and polyether polyol with different long chain molecular weight (PTMG-1000/2000). The viscosity of final products was weakened by the active diluent. Based on the characteristics of dendritic and long-chain polymers, cured resin materials for 3D printing having low shrinkage, low viscosity and good ductility was prepared. To identify the end point of reaction, we exploited Fourier transform infrared spectrometer (FTIR) and toluene-dibutylamine titration method. Thermogravimetric analysis (TGA), tension machine, viscometer, Shore hardness and shrinkage rate were used to analyze the properties of prepolymer and dilute monomer with different weight percentage after light curing. The experimental results showed that higher content of dendritic polymers could be more effective to reduce the deformation caused by curing. Adding long chain polymers could make up for the high hardness and brittleness of dendritic polymers. This research results make 3D printing photosensitive resin more extensive in application.