某一動態隨機存取記憶體的碳足跡盤查之研究

The Study of the Carbon Footprint Inventory of a Dynamic Random Access Memory Chip

鄭景隆(Ching-Lung Cheng)

指導教授 ： 蔡春進

國立交通大學/工學院/工學院永續環境科技學程/碩士(2011年)

https://doi.org/10.6842/NCTU.2011.01024

摘要

本研究以產業溫室氣體(GHG)盤查為基礎，加入「產品生命週期評估(LCA)」的概念，探討某一半導體廠製造動態隨機存取記憶體(DRAM)晶片所產生的溫室氣體排放量，以二氧化碳當量表示之，即是所謂產品碳足跡(Carbon Footprint)。
本計劃以PAS2050為執行架構，並參考ISO14064-1及ISO14040的方法，計算產品碳足跡。盤查與計算的範疇包含原料提供、工廠製造、運輸配送等生命週期活動階段，藉由本計劃執行達到以下目的：1.了解電子產品之碳足跡排放量2.提昇公司形象並降低競爭壓力，做為該電子產品前瞻者3.分析產品各生命週期階段的排放量，尋找減碳之機會4.因應國際減碳議題，降低單位減碳成本5.綠化供應鏈，回應利害相關者關心的環境議題。
本產品系統邊界採B2B(Business-to-Business)，即企業至企業的評估方式，計算結果為產品供應鏈三階段:原料取得、生產製造及成品運輸的碳排放數據總和。本研究發現產品碳排放為0.71kg-CO2e/記憶體顆粒，其中以工廠生產製造過程占83.39 %貢獻碳足跡最大，其次為原料取得的16.58%，及成品運輸的0.03%，因此，分析將來工廠生產製造使用電力消耗最具有減碳的空間。

關鍵字

碳足跡 ； 溫室氣體 ； 生命週期評估 ； PAS2050

並列摘要

The greenhouse gases (GHG) emission of a dynamic random access memory (DRAM) product was studied. The emission was calculated as CO2 equivalence and defined as the carbon footprint (CFP). It was based on enterprise’s inventory of GHG emissions and the concept of product life cycle assessment (LCA).
The calculation of the product’s carbon footprint was based on the PAS 2050 and the standard methods of ISO14064-1 and ISO14040. The project scope of the inventory and calculation has three parts: the manufacturing of raw material, the manufacturing of product in the factory and transportation. The purposes of this study are:
1.To the carbon footprint emission of DRAM product
2.To improve the image of the company and reduce the pressure from competitors
3.To analyze the CO2 emission data and find the opportinities for carbon reduction
4.To respond to the international environmental issues and reduce cost of carbon reduction in the future
5.To form a green the supply chain.
The system boundary of the product carbon footprint assessment is B2B (Business-to-Business) and the calculated results of carbon emission data are divided into three parts:the manufacturing of raw material, the manufacturing of product in the factory and transportation. It was found that the carbon emission is 0.71kg-CO2e/chip with the biggest contribution of 83.39% from the manufacturing of product in the factory, followed by the manufacturing of raw material (16.58 %) and transportation (0.03%). The results indicate that we should reduce carbon emission about electric power consumption in the manufacturing process of the product as the first priority in the future.

並列關鍵字

carbon footprint ； greenhouse gases ； life cycle assessment ； PAS2050

參考文獻

18.CNS ISO 14040:2006 生命週期評估-原則與架構，2008年12月。

25.行政院環境保護署，「產品與服務碳足跡計算指引」，2010年2月。

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7.Finkbeiner M, Inaba A, Tan RBH, Christiansen K, Kluppel H-J, ”The new international standards for life cycle assessment: ISO 14040 and ISO 14044”, Int J Life Cycle Assess 11(2):80-85, 2006.