Ultrasonic vibration-assisted hot glass embossing technique is a novel method to produce field emitter electrodes. Although ultrasonic vibration-assisted hot glass embossing process has been studied, effect of process parameters on the filling ability of the glass into the microstructures which shaped as pyramid array has not been carried out so far. Therefore, the purpose of this research is to study effect of ultrasonic vibration on improving filling ability of glass material into the pyramid arrays' structures as well as to carry out the influence of process's parameters on the quality of molded microstructure.This research successfully embossed pyramid arrays’ microstructures on K-PSK100 plate glass specimen using hot embossing process with the assistance of ultrasonic vibration (frequency of 35 kHz, amplitude of 4μm). Furthermore, effect of some parameters such as embossing temperature, embossing speed, lower mold geometry and ultrasonic vibration on the final shape of pyramid microstructures were investigated.