導電高分子應用在印刷電路板層間微孔內連結製作方法之研究

陳建宏(Chien-Hung Chen)

指導教授 ： 楊思明

國立中央大學/工學院/化學工程與材料工程學系/碩士(2008年)

摘要

微孔（Microvias）的導通技術於印刷電路板當中一直是個被熱門討論的話題之一。本研究主要是利用印刷電路板於鍍通孔(Plated
Through Hole , PTH)的技術中, 除膠渣(Desmear)製程中所使用到的高錳酸鹽做為氧化劑,於非導體的材質環氧樹脂和玻璃纖維表面上化學合成導電高分子聚苯胺，更利用聚苯胺在ES態（Emeraldine salt）和LM態（Leucoemeraldine Base）不同的還原能力在其表面將鈀離子和銅離子還原，並探討其在化學鍍銅或導電高分子製程中的可行性。
實驗鑑定上，藉由SEM影像分析玻纖樹脂表面經除膠渣後的表面形態，由EDX分析進行表面成份的鑑定，再藉由ESCA偵測束縛能了解樣品表面元素價態的情況，最後透過FT-IR鑑定在玻纖樹脂表面上合成的產物是否為聚苯胺。另外，在金屬還原部分藉由SEM分析觀察金屬顆粒分別沉積在ES態和LM態聚苯胺上的現象，在由EDX分析進行表面成份的鑑定，最後再以四點碳針去量測聚苯胺及金屬複合物的導電度。

關鍵字

導電高分子 ； 聚苯胺 ； 印刷電路板

並列摘要

The Plate Through Hole（PTH）technology is always one of the popular topics in the printed circuit board. In this study, we use the permanganate which generates an oxidation layer to polymerize aniline on the surface of epoxy resin and glass fiber of the printed circuit board to form polyaniline. Furthermore, palladium and copper ions are deposited from salt solutions by the different reducing abilities of emeradine salt (ES) and leucoemeradine base (LB) forms of polyaniline.
The surface morphology is studied by SEM, the formation of palladium and copper are identified from EDX analysis. The distribution of metals is obtained from EDX mapping. X-ray photoelectron spectroscopy is employed for the characterization of surface compositions and chemical states of the manganese. XPS results show that MnO2 was formed on the surface of printed circuit board. FT-IR spectra indicate that polyaniline is formed on the surface of printed circuit board by the reaction between aniline and MnO2 on the surface. SEM photographs and EDX mapping results show that the deposition of Pd and Cu occurred more efficiently on the LB form than the ES form of polyaniline. We also measure the conductivity of PANI/metal composites material by Four-Point Conductive measurements and show high conductivity (＞1.6×104 Scm-1) of the composite formed from LB compared to those formed from ES (6.12 Scm-1).

並列關鍵字

PCB ； polyaniline ； conducting polymer

參考文獻

9.印刷電路板簡介，林定晧，2005，台灣電路板協會.

10.電路板基礎製程簡介，林定晧，2001，台灣電路板協會.

1.Y. M. Lin and S. C. Yen, “Effects of Additives and Chelating Agents on Electroless Copper Plating,” Applied Surface Science, Vol. 178, 2001, pp. 116-126.

3.彭超, 碩士論文, “奈米鈀金屬活化液之製備及其在化學鍍銅

5.M.Paunovic and M.Schlesinger, Fundamentals of Electrochemical Deposition, John Wiley & Sons, Inc., New York, Ch. 8 (1998).