應用有限元素法於覆晶軟板式FCOF之 參數化設計與數值分析

覆晶軟板(Flip Chip-on-Film, FCOF)技術中之內引腳壓合(Inner Lead Bonding, ILB)製程中包含熱壓溫度、熱壓時間、凸塊尺寸、引腳尺寸、引腳鍍錫量、以及壓合力量等製程參數，其接合情況將直接影響產品的良率與可靠度。一般來說，較差的良率以及可靠度大部分導因於製程引發的熱變形以及應力/應變行為所造成的，而這些行為通常會導致不同的破壞模式。本研究主要目的在於建立一個最佳化製程參數設計，文中將考慮內引腳接合後整體結構強度分析以及接合過程溫度傳遞現象，以有限元素法建立模型，完成深入分析與模型驗證。在實驗方面完成壓合力量與下沉量、尺寸變動與結構變形、引腳接合時的熱傳溫度，上述各項實驗數據可用於驗證有限元素模型的正確性。在數值分析方面首先完成單引腳模型，可用以討論引腳斷裂位置的影響，以及探討壓合力量、下沉量、凸塊尺寸三變異數間的最佳化製程。之後探討內引腳接合過程的溫度傳遞現象。凸塊材料從金凸塊改成複合金凸塊(Composite Bump)，更動製程參數，以探討壓合參數變化其影響。本文之研究成果將有助於FCOF-ILB 製程產品的開發，並且提供相關的內引腳設計參考。 (關鍵詞：覆晶軟板FCOF，內引腳接合ILB，有限元素法FEM，複合金凸塊Composite Bump)

關鍵字

有限元素法；覆晶軟板；電子封裝

並列摘要

Flip Chip-On-Film (FCOF) is a very important technique about electronic packaging in the present eneration. It is fundamentally dependent upon the quality of the inner lead bonding (ILB)parameters, such as bump size, lead size, Tin on lead, bonding force and bonding duration. Different bonding parameters influence yield and reliability immediately. General speaking, the failure mode was happened due to thermal stress and strain. The aim of this research is to establish an optimization methodology of parameters enactment. It contain the bonding strength of ILB interconnection, the eutectic bonding temperature. Creating model of FCOF structure using finite element method(FEM) and then verify the model. Simulation of bonding behavior expect deformation using single lead model. Die, gold bump, copper lead and polyimide film constitute FE model. There are some experiments in this study for checking the relation of parameters and deformation that including bonding force, sinking value, bump dimension, composite bump and heat transformation. The foregoing experiments can be used to verify the correctness of the FE model. Investigating the phenomena of temperature distribution and changing bonding parameters infer the influence of the two issues. Conclusion of this study is contributive for the development of FCOF ILB products, providing design chart for reference about ILB and composite bump. (Keywords: flip chip on film, eutectic bonding, parameters enactment,finite element method, inner lead bonding, composite bump)

並列關鍵字

Finite element method ； Flip chip on film ； Electronic package

參考文獻

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應用有限元素法於覆晶軟板式FCOF之參數化設計與數值分析

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