應用超臨界二氧化碳於電鍍銅合金之研究

本研究利用直流電鍍法在超臨界二氧化碳(SC-CO2)的條件下製備銅鍍膜及銅鎳合金鍍膜，並藉由電化學方式分析抗腐蝕能力。工業上常用電鍍銅來當物件底鍍，但電鍍銅膜時，表面常因氫氣吸附造成鍍膜產生針孔，導致抗蝕力降低。本實驗使用一高壓釜來架設SC-CO2下電鍍銅膜之反應裝置，操作壓力為0.1~20.7MPa、溫度35℃，固定轉速350rpm，並檢測鍍銅膜表面之耐腐蝕與機械性質。發現於SC-CO2下電鍍，可大量減少針孔，相對於常壓可提升抗腐蝕性約10倍，其主要原因為SC-CO2可溶解電極表面產生的氫氣，導致鍍膜針孔量減少。在表面形貌方面，利用SC-CO2電鍍法可得較緻密且平整的鍍層，且在13.8MPa與10.2MPa分別有最小的晶粒尺寸與最大的硬度(提升約1.25倍)。另外於未加入添加劑PEG 200下，SC-CO2鍍銅晶面由(111)轉為(220)。銅鎳合金粗糙度與晶粒尺寸(13.8MPa有最小)隨著壓力增加而降低，且耐腐蝕也有提升。

關鍵字

銅鎳合金；銅；超臨界電鍍

並列摘要

This study investigated the characteristics of electroplated copper and copper-nickel alloy films under supercritical carbon dioxide (SC-CO2) and further discussed their corrosion resistance through electrochemical analysis. In the industry, copper plating process is commonly used before other electroplating. However, pinholes are easily generated on the copper film due to the hydrogen adsorption during electroplating and lead to corrosion. To cope with this issue, a high pressure vessel was designed as a SC-CO2 electroplating reactor with operating pressure ranging from 0.1 to 20.7MPa, 35℃, and 350 rpm. The corrosion resistance and mechanical properties of electroplated copper films were examined. Results showed that the amount of pinhole was significantly reduced and the corrosion resistance was significantly enhanced about 10 times in SC-CO2 in comparison with ambient environment, due to SC-CO2 dissolving hydrogen generated on the electrode surface. Also, the roughness of surface decreases with increasing pressure. A minimum value for grain size and a maximum value for hardness (about elevating 1.25 times) were observed for the copper films electroplated at 13.8MPa and 10.2MPa, respectively. Without the additive PEG 200, the lattice preferred orientation of the copper film electroplated in SC-CO2 changes from (111) to (220). As to the copper nickel alloy film, increasing pressure can decrease the roughness and grain size with a minimal at 13MPa. In addition, the corrosion resistance was enhanced under SCCO2 electroplating.

並列關鍵字

copper nickel alloys ； copper ； supercritical carbon dioxide

參考文獻

黃盟議，林昭任。(2012)。應用超臨界二氧化碳電鍍碲硒化鉍熱電薄膜之研究。國立中正大學化學工程學系。

鄭鈞元，李春穎。(2012)。超臨界電鍍銅製程之奈米鍍層內應力及導電性探討。機電整合研究所。國立台北科技大學。

Alvarez, R. B., Martin, H. J., Horstemeyer, M. F., Chandler, M. Q., Williams, N., Wang, P. T., Ruiz, A. (2010). Corrosion relationships as a function of time and surface roughness on a structural AE44 magnesium alloy. Corros. Sci., 52, 1635-1648.

Baskaran, I., Sankara Narayanan, T. S. N., Stephen, A. (2006). Pulsed electrodeposition of nanocrystalline Cu-Ni alloy films and evaluation of their characteristic properties. Mater. Lett., 60, 1990-1995.

Bonou, L., Eyraud, M., Denoyel, R., Massiani, Y. (2002). Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements. Electrochim. Acta, 47, 4139-4148.

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應用超臨界二氧化碳於電鍍銅合金之研究

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