摘要
傳統製作薄膜電晶體顯示器(TFT-LCD)需經過薄膜、黃光和蝕刻等半導體製程，製作成本和花費時間常為人所詬病。噴墨(ink-jet)技術具有可高速運作、安靜、非接觸作用與能由電腦控制等特性，並有材料利用率高、低成本與更環保等優點。運用噴墨技術，利用噴墨頭在玻璃基板上印刷塗佈成所需要的圖案(pattern)。在目前面板製程中，傳統所使用的金屬導線大多為鉻、鋁與鉬或各種合金混層結構。因此，基於IC製程的經驗，更低電阻率的導線，如銅、銀和金等的開發價值便慢慢浮現。 本研究主要方向為藉由噴墨技術，於玻璃基板上噴印出具有良好附著性之銀金屬導線。因此，銀與玻璃基板間之附著能力為本研究之重點。研究初期將基板溫度效應、UV強化、基板電漿改質、基板鍍鈦薄膜及基板披覆OTS膜為附著性實驗之參數，再以最佳之參數應用於實際噴墨製程。實驗結果顯示，銀於鍍鈦膜之玻璃基板上具有最好之附著能力，特別在燒結溫度250℃下持溫一小時。 噴墨製程方面，於鍍鈦薄膜之玻璃基板上，在噴墨電壓100V、噴墨頻率2.4 kHz及墨滴間距200μm時可得一平整性與附著性均佳之銀金屬導線。
並列摘要
The traditional fabrication method of thin-film transistor liquid crystal display (TFT-LCD) was to use semiconductor fabrication process, including thin film, photo lithography and etching. It was often denounced with the consuming of cost and time. Ink-jet technology has the characteristics of high-speed operation, quiet, noncontact , can controlled by computer and had the advantages of materials are used effectively, costs are lowered and more environmentally-friendly, etc. Ink-jet technology is applied to print the pattern what we want on the glass substrate by using printhead. At present, the metal conducting wires used traditionally in array of panel are usually the Cr, Al, Mo or alloy mixed structure. Therefore, based on the experience of IC system fabrication, the development of lower resistance conducting wire like Cu, Ag, Au, etc are more important. The purpose of this research is to print a well-adhesion silver conducting wire on a silica substrate by ink-jet printing. Therefore, the adhesion between the silver wire and silica substrate is a key point in the research. At the first of research, the experimental parameters of adhesion are temperature effects of substrate, UV enhancement, plasma modification for substrate, titanium-coated substrate and OTS-coated substrate. Further, the best parameter from above was selected for ink-jet printing. The results indicate it can form well adhesion between silver and titanium-coated silica substrate, especially in the sintering temperature of 250℃ for 1 hr. In the process of printing, a well shape and adhesion of silver conducting wire on titanium-coated silica substrate was obtained at the pulse amplitude of 100V, frequency of 2.4 kHz and drop separation 200μm.
參考文獻
延伸閱讀
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