本研究主要是經由在流體入口和散熱鰭片之間建立流體擴散區進而使一個電子冷卻系統得到改善。 在這個簡單的設計中有三個優點是可以觀察到的,因為這項設計可以驅使入口的均勻流體擴散成為非均勻流體,第一個優點是這個設計可以明顯的增加其冷卻的效率,第二個好處則是可以在出口處產生引流之現象,經由擴散的流體引導,出口外之氣體可以被引入部分與散熱鰭片接觸,進而增加更多的熱交換,增加其散熱效率。經由較長之擴散區可以輕易的減緩入口氣體與散熱鰭片的直接衝擊,減少冷卻系統之壓降,降低風扇之負荷。 而在本研究中可以通過擴散區來降低5%至10%的熱阻值,我們將能在本研究中清楚的現。
This study is to investigate the cooling enhancement of an electronic cooling system due to the installation of a flow diffusion passage located between the uniform flow inlet and the heat sink. There are three advantages can be observed from this simple design. Since the design of this study can change the uniform inlet flow into nonuniform flow distribution through the flow diffusion passage, the first advantage is that this design can increase the cooling effect. The second advantage of this design is obtained from entrained flow occurrence near the downstream outlet region that can increase the mass flow rate accumulated around the heat sink and carry away more heat out of heat sink. The third advantage is that a longer flow diffusion passage will smoothly induce the flow impact over the solid rectangular fin array and hence that can even decrease the pressure loss of this cooling system. In the present study, 5% to 10% of thermal resistance ratio can be decreased through the specification and the arranged range appeared in this study.