BGA模組晶片和電路板的動態衝擊分析與測試驗證

Impact Simulation and Test Verification of PCB with BGA Chipset

鄭根全(K. C. Cheng) ； 黃健生(J. S. Huang) ； 王阿成(A. C. Wang)

《先進工程學刊》 3卷3期 (2008/06) Pp. 251-256

https://doi.org/10.29948/JAE.200806.0011

摘要

本文針對Shock衝擊對手機電路板(PCB)上BGA錫球動態分析之研究，由於目前一般研究的方法大多在電路板上靠近BGA封裝晶片旁邊，貼上應變規、加速規等感應器，經由量測訊號之擷取後再進行研究與解析，因此，本研究的方法是結合電腦輔助分析軟體LS-DYNA進行BGA電路板的Shock衝擊有限元素法的動態分析，並執行BGA電路板實物之Shock測試，再利用有限元素法分析的結果，探討在動態衝擊下BGA錫球最大von Mises應力之分佈特性；經由分析與測試結果比較，得到二者的應變量大小吻合，可以確定本文所用的有限元素模型及其相關材料性質之參數設定是正確的，此結果亦可供後續BGA電路板設計之參考。

關鍵字

shock衝擊 ； BGA ； 電路板PCB ； 有限元素法

並列摘要

The study in this paper illustrates the dynamic analysis of the shock impact simulation of PCB with BGA tin balls. General method to study BGA solder strength was often adhered accelerometer or strain gauge or other sensor on the PCB near the BGA chipset, then captured the response signal data for further analysis. Therefore, by utilizing the LS-DYNA software package of finite element method to this simulation, the distribution of von Mises stresses on the tin balls can be numerically obtained. The corresponding strains can be compared with those from the experimental measurement by means of the strain gauge which is the traditional approach for the PCB shock test. From the comparison, they only have a few difference about 0.7% and yields satisfactory results. Therefore, the parameters of the mechanical properties chosen in our finite element model should be generalized to the related design engineering of PCB with BGA chipsets.

並列關鍵字

shock impact ； ball grid array BGA ； printed circuit board PCB ； finite element method