|
Reference
[1] ITRS, International Technology Roadmap for semiconductors Conference, Hsinchu, Taiwan, 2003. [2] T.S. Huck et al., Current Opinion in Solid State and Materials Science, Polymers in nanotechnology, 6, 2002,3-8. [3] Y. Xia, X.M. Zhao and G.M. Whitesides, Microelectronic Engineering, PP. 255-268, 1996 [4] Hong-Wei Li, Beinn V.O. Muir, Guillaume Fichet, and Wilhelm T.S. Huck, Langmuir 2003,19,1963-1965 [5] W. Henschel,a) Y. M. Georgiev, and H. Kurz. J. Vac. Sci. Technol. B, Vol. 21, No. 5, Sep’Oct 2003 [6]Jie Feng, Changyou Gao, Bo Wang, Jiacong Shen, Colloids and Surface B:Biointerfaces 36 (2004) 177-180 [7] Dahl-Young Khang and Hong H. Lee, Appl. Phys. Lett., Vol. 76, No. 7(2000) [8] C.C. Yang、W.C. Chen, J. Mater. Chem., 12, 1138-1141(2002) [9] H .-C . Scheer ,H . Schulz, Microelectronic Engineering, 56, 311– 332 (2001). [10] 邱昱維、楊子寬、黃紀嚴, The Research of Coating Mode between the Silane Coupling Agent and Nano-Alumina Powder, 第二屆資源工程研討會論文集 [11]L.D.White and C.P.Tripp, Journal of Colloid and Interface Science 232, 400-407 (2000) [12] Dissertation for the Degree of Doctor of Philosophy in Engineering Science with specialisation in Materials Science presented at Uppsala University, Comprehensive Summaries of Uppsala Dissertations from the Faculty of Science and Technology 843,2003 [13]N-(3-(TRIMETHOXYSILYL)PROPYL)ETHYLENEDIAMINE (AEAPTMS),SID Initial Assessment Report For SIAM 17,2003 [14]Pascal Gallo, Benoit Viallet, Emmanuelle Daran, Chantal Fontaine, Applied Physics Letter 87, 183111 (2005) [15] H.-C. Scheer, and H. Schulz, J. Vac. Sci. Technol. B, 16, 6(1998). [16] S Zankovych, T Hoffmann, J Seekamp, J-U Bruch and C M Sotomayor Torres, Nanotechnology 12, 91–95(2001). [17] Lisa C. Shriver-Lake , Wm. Bryce Gammeter,Sookie S. Bang, Mehran Pazirandeh, Analytica Chimica Acta 470 (2002) 71–78 [18] Dahl-Young Khang and Hong H. Lee, Appl. Phys. Lett., Vol. 76, No. 7(2000) [19] M.M. Alkaisi , R.J. Blaikie, S.J. McNab, Microelectronic Engineering, 57,367– 373(2001) [20] C. Martin, L. Ressier., J.P. Peyrade, Physica E, 17, 523 – 525(2003) [21]晶圓鍵合製程與設備介紹, 劉俊賢, 徐嘉彬. 光電與半導體設備技術專輯機械工業雜誌 246期。
|