晶圓代工模式造就了半導體產業典範移轉。其不僅加速了半導體產業專業分工的模式，更創造了數以百萬美元計的商機。在可預見的未來，晶圓代工將因不斷提高核心競爭力，而在半導體產業中扮演更重要的角色。核心競爭力即指客製化製程技術的開發，先進且具彈性的生產技術及客戶導向的服務體系。協助將客戶的新產品及時且成功的在市場上推出，是晶圓代工廠重要的能力指標。
本研究以系統工程之思維模式，就半導體客製化新製程導入的過程，建立整合性的管理方法。此研究目的將晶圓代工多元且複雜的客製化新製程導入過程，建構一可行之管理方法。
本文以一個晶圓代工廠為例，根據案例公司的實際經驗，以系統工程的角度，利用專案管理，同步工程，品質機能展開等手法工具，建構一套晶圓代工新產品導入之管理模式。藉以達成縮短產品開發時間，減少開發過程中的人為錯誤，降低開發成本。

The foundry business model has created a paradigm shift in the semiconductor industry. The model not only accelerates the dis-integration trend in semiconductor industry, but also provides billions of foundry business benefits. In the next decade, the semiconductor foundry will play an even more important role in the semiconductor business because of the continuous raise of the core competition. The core competition indicates the development of customization technology, the advanced and flexible production technology, and the customer oriented service system. The key goal for the semiconductor foundry is to help customers efficiently achieve their new products time-to-market.
Based on the system engineering perspective, this thesis aims to develop an integrated management method on the process of new customized technology development. The thesis utilizes the project management, the concurrent engineering, and the quality function deployment to construct a management model of the foundry business. The model plans to shorten the time, decrease the mistakes and lower the cost when the new technology process is adopted. A case study of a specific factory is exemplified to test and demonstrate the management model.

第1章 緒論 1
1.1 研究動機 1
1.2 研究議題與目的 5
1.3 問題定義與研究範圍 5
1.4 論文架構 8
第2章 文獻探討 10
2.1 新產品開發與新製程開發 10
2.1.1 新產品開發流程相關文獻 10
2.1.2 半導體晶圓代工產業的新製程開發 12
2.2 系統工程整合性方法論 17
2.3 同步工程 21
2.4 品質機能展開 Quality Function Deployment QFD 28
2.5 自DfM 至 DfX 30
2.5.1 DFM的一般運用 30
2.5.2 DFM在半導體產業上的運用 32
2.5.3 DFX 36
2.5.4 小結 37
第3章 客製化新製程開發整合性設計模式 38
3.1 整合性開發管理系統架構屋 38
3.2 發展模組 40
3.2.1 思考模式 41
3.2.2 需求模式—品質機能展開技術（QFD） 43
3.2.3 程序模式 45
3.3 分析模組 46
3.3.1 策略決策模式 47
3.3.2 流程模式化 48
3.4 執行模組 50
3.4.1 開發專案管理 50
3.4.2 發展績效衡量系統 55
3.5 整合之資訊化環境 57
第4章 客製化晶圓代工新製程開發案例 59
4.1 案例公司簡介 59
4.2 客製化半導體製程開發專案的發展模組 63
4.3 客製化半導體製程開發專案的分析模組 65
4.3.1 半導體製程技術開發的技術策略決策 65
4.3.2 半導體製程技術開發的流程模式化 67
4.4 客製化半導體製程開發專案的執行模組 70
4.4.1 客戶需求到生產線控制要素_品質機能展開 70
4.4.2 執行模組的開發專案流程 77
4.5 整合性資訊環境的建立 77
第5章 結論與後續研究方向 79
5.1 研究結論 79
5.2 後續研究方向 80
參考文獻 81

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