|
chapter 1 [1] C. T. Kresge, M. E. Leonowicz, W. J. Roth, J. C. Vartuli, J. S. Beck, ibid. 359, 710 (1992). [2] J. S. Beck et al., J. Am. Chem. Soc. 114, 10834 (1992). [3] Q. Huo, D. I. Margolese, G. D. Stucky, Chem. Mater. 8, 1147 (1996). [4] D. Zhao, J. Feng, Q. Huo, N. Melosh, G. H. Fredrickson, B. F. Chmelka, G. D. Stucky, Science 279(23):548-52 (1998). [5] Unger, K. K. In Po rous Slica- Its Prop erties and Use as Support in Column Liquid Chromatography, Vol. 16, Elsevier: Am ster dam, 1979. [6] Price, P. M.; Clark, J. H.; Macquarrie, D. J. J. Chem. Soc., Dal ton Trans. 2000, 101. [7] Moller, K.; Bein, T. Stud. Surf. Sci. Catal. 1998, 117, 53. [8] Zhao, X. S.; Lu, G. Q. J. Phys. Chem. B 1998, 102, 1556. [9] Mercier, L.; Pinnavaia, T. J. En vi ron. Sci. Technol. 1998, 32, 2749. [10] Beck, J. S.; Calabro, D. C.; McCullen, S. B.; Pelrine, B. P.;Schmitt, K. D.; Vartuli, J. C. In Method for Functionalizing Synthetic Mesoporous Crystalline Material, Mobil Oil Corp.: USA, 1992. [11] Lim, M. H.; Blanford, C. F.; Stein, A. Chem. Ma ter. 1998, 10, 467. [12] van Rhijn, W. M.; De Vos, D. E.; Sels, B. F.; Bosaert, W. D.; Jacobs, P. A. Chem. Commun. 1998, 317. [13] Stein, A.; Melde, B. J.; Schroden, R. C. Adv. Mater. 2000, 12, 1403. [14] De Juan, F.; Ruiz-Hitzky, E. Adv. Mater. 2000, 12, 430.
chapter 2 [1] Martin SJ, Godschalx JP, Mills ME, Shaffer II EO, Townsend PH. Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect. Adv Mater 2000;12(23):1769-78. [2] Kreuz JA, Edman JR. Polyimide films. Adv Mater 1998;10(15):1229-32. [3] Vora RH, Gopala Krishnan PS, Goh SH, Chung TS. Synthesis and properties of designed low-k fluoro-copolyetherimides. Part1. Adv Funct Mater 2001;11(5):362-73. [4] Cha HJ, Hedrick J, DiPietro RA, Blume T, Beyers R, Yoon DY. Structure and dielectric properties of thin polyimide films with nano-foam morphology. Appl Phys Lett 1996;68(14):1930-2. [5] Hedrick JL, Hawker CK, DiPietro R, Jerome R, Charlier Y. The use of styrenic copolymers to generate polyimide nanofoams. Polymer 1995;36(25):4855-66. [6] Narkis M, Puterman M, Boneh H, Kenig S. Rotational molding of thermosetting three-phase syntactic foams. Polym Eng Sci 1982;22(7):417-21. [7] Tiwari A, Gupta MK, Pandey KN, Mathur GN, Nema SK. Encapsulation of air-filled poly(dimethylsiloxane) microballoons in polyimide as a polymeric lowεdielectric. Polym Int 2004;53:1744-51. [8] Wang WC, Vora RH, Kang ET, Neoh KG, Ong CK, Chen LF. Nanoporous ultra-low-k films prepared from fluorinated polyimide with grafted poly(acrylic acid) side chain. Adv Mater 2004;16(1):54-7. [9] Jiang LY, Leu CM, Wei KH. Layered silicates/fluorinated polyimide nanocomposites for advanced dielectric materials application. Adv Mater 2002;14(6):426-9. [10] Zhao D, Feng J, Huo Q, Melosh N, Fredrickson GH, Chmelka BF, Stucky GD. Triblock copolymer syntheses of mesoporous silica with periodic 50 to 300 angstrom pores. Science 1998;279(23):548-52. [11] Schüth F, Schmidt W. Microporous and mesoporous materials. Adv Eng Mater 2002;4(5):269-79. [12] Chen-Yang YW, Chen CW, Wu YZ, Chen YC. High-performance circuit boards based on mesoporous silica filled PTFE composite materials. Electrochem Solid- State Lett 2005;8(1):F1-4. [13] Wallach ML. Structure-property relations of polyimide films. J. Polym. Sci. 1968; A-2,6: 953-60. [14] Volksen W, Cotts P, Yoon DY. Molecular weight dependence of mechanical properties of poly(p,p’-oxydiphenylene pyromellitimide) films. J. Polym. Sci. 1987; A-2, 25:2487-95. [15] Ahmed S, Jones FR. A review of particulate reinforcement theories for polymer composites. J. Mater Sci 1990; 25:4933-42. [16] Jancar J, Dainselmo A, Dibenedetto AT. The yield strength of particulate reinforced thermoplastic composites. Polym Eng Sci 1992;32:1394-99. [17] Yen CT, Chen WC, Liaw DJ, Lu HY. Synthesis and properties of new polyimide–silica hybrid films through both intrachain and interchain bonding. Polymer 2003;44:7079- 87. [18] Fu BX, Gelfer MY, Hsiao BS, Philips S, Viers B, Blanski R, Ruth P. Physical gelation in ethylene–propylene copolymer melts induced by polyhedral oligomeric silsesquioxane (POSS) molecules. Polymer 2003;44:1499-1506. [19] Maxwell- Garnett JC. Colours in Metal Glasses and in. Metallic films. Phil Trans Roy Soc Series A 1904;23:385-420. [20] Hedrick JL, Miller RD, Hawker CJ, Carter KR, Volksen W, Yoon DY, Trollsas M. Templating nanoporosity in thin-film dielectric insulators. Adv Mater 1998;10(13):1049-53. [21] Todd M, Shi F. Molecular basis of the interphase dielectric properties of microelectronic and optoelectronic packaging materials. IEEE T Compon Pack T 2003;26(3):667-72.
chapter 3 [1] C. C. Hu, Y. H. Huang, J. Electrochem. Soc., 146, 2465 (1999). [2] C. C. Hu, K. H. Chang, Electrochim. Acta., 45, 2685 (2000). [3] B. E. Conway, Electrochemical Supercapacitors, p. 15, Kluwer-Plenum, New York (1999). [4] S. Sarangapani, B. V. Tilak, C. P. Chen, J. Electrochem. Soc., 143, 3791 (1996). [5] M. Ramani, B. S. Haran, R. E. White, B. N. Popov, J. Electrochem. Soc., 148, A374 (2001). [6] J. W. Long, K. E. Swider, C. I. Merzbacher, D. R. Rolison, Langmuir, 15, 780 (1999). [7] J. P. Zheng, P. J. Cygon, T. R. Jow, J. Electrochem. Soc., 142, 2699 (1995). [8] D. A. McKeown, P. L. Hagans, L. P. L. Carette, A. E. Russell, K. E. Swider, D. R. Rolison, J. Phys. Chem. B, 103, 4825 (1999). [9] C. Lin, J. A. Ritter, B. N. Popov, J. Electrochem. Soc., 145, 4097 (1998). [10] A. Burke, J. Power Sources, 91, 37 (2000). [11] a) C.C. Hu, C. Y. Cheng, Electrochem. Solid-State Lett., 5, A43 (2002). b) C. C. Hu, T. W. Chou, Electrochem. Commun., 4, 105 (2002). [12] C. Niu, E. K. Sichel, R. Hoch, D. Moy, H. Tennent, Appl. Phys. Lett., 70, 1480 (1997). [13] K. E. Swider, C. I. Merzbacher, P. L. Hagans, and D. R. Rolison, Chem. Mater., 9, 1248 (1997). [14] C. C. Hu, W. C. Chen, K. H. Chang, J. Electrochem. Soc., 151, A281 (2004). [15] K.S.W. Singh, D.H. Everett, R.H.W. Haul, L. Moscou, R.A. Pierotti, J. Rouquerol, T. Siemieniewska, Pure Appl. Chem., 57, 603 (1985). [16] S. Alvarez, M.C. Blanco-Lopez, A.J. Miranda-Ordieres, A.B. Fuertes, T.A. Centeno, Carbon, 43, 855 (2005). [17] V. Subramanian, Sean C. Hall, Patricia H. Smith, B. Rambabu, Solid State Ionics, 175, 511 (2004). [18] D. Zhao, J. Feng, Q. Huo, N. Melosh, G. H. Fredrickson, B. F. Chmelka, G. D. Stucky, Science, 279, 548 (1998). [19] T. R. Jow and J. P. Zheng, J. Electrochem. Soc., 145, 49 (1998). [20] B. D. Cullity, Elements of X-Ray Diffraction, 2nd ed., p. 281, Addison-Wesley, Reading, Massachusetts (1978). [21] S. Lowell, Joan E. Shields, Martin A. Thomas, Matthias Thommes, Characterization of Porous Solids and Powders: Surface Area, Pore size and Density, p. 11, Kluwer Academic Publishers, Netherlands (2004). [22] P. Yang, D. Zhao, D.I. Margolese, B.F. Chmelka, G.D. Stucky, Nature, 396, 152 (1998). [23] J. P. Zheng, Electrochem. Solid State Lett., 2, 359 (1999). [24] F. A. Posey, T. Morozumi, J. Elctrochem. Soc., 113, 176 (1966). [25] B. E. Conway, Electrochemical Supercapacitors, p. 259, Kluwer-Plenum, New York (1999). [26] J. P. Zheng, Y. Xin, J. Power Sources, 110, 86 (2002). [27] B. E. Conway, Electrochemical Supercapacitors, Kluwer-Plenum, New York, 1999, p. 551-552.
|