本研究針對多維積體化多工特殊晶片設計(ASIC)應用於大陣列微機電系統驅動與控制深入研究。龐大微機電陣列系統需要精密且多工的訊號去驅動與控制是共同的特徵，致使微機電元件符合更高科技發展應用。本研究對噴墨晶片、熱光光開關陣列及LED背光顯示器驅動與控制深入探討，現階段噴墨印頭技術已完成直接驅動晶片墨滴開發，缺點是當列印速度越來越快，解析度越來越高時，需要更微小驅動時間及更多的噴孔數被控制，繼續使用此架構會被侷限住；熱光光開關已完成直流電壓驅動熱阻，電流通過加熱器微環，金屬薄膜通電發熱，改變了波導分支區域內的熱量分佈，導致其下面的波導的折射率發生變化，這樣就可以將光耦合從主波導引導至目的分支波導，而實現光的開關動作，缺點是需要高速率、大容量資訊傳輸、存貯、交換與處理的研究，陣列熱光光開關數目多，直流電壓驅動熱阻產生可靠度降低切換速度慢及溫度不穩定。LED背光顯示領域，全球各大TFT-LCD面板廠及背光模組廠積極研發，以發光二極體(LED)當作背光模組。由於發光二極體色彩飽和度高及無汞汙染問題，使其有充分理由取代現有冷陰極管，但在電路控制、散熱問題、高耗電量、及以往CCFL動態背光只能整體變暗變亮的局限等技術尚待解決。數量龐大的微機電陣列系統，考量到每一模組被電訊號驅動的時間、功率、及切換速度。本研究提出新的多維積體化多工晶片應用於大陣列微機電系統驅動與控制，以符合數量龐大的微機電陣列元件整合系統下運作，與傳統陣列架構相較多一個可選擇的處理訊號，擁有最高優先權的選擇方式，產生這些訊號的電路需具備在特定有資料段的時間點送出訊號，所以使用資料移位暫存器(shift register)跟資料閉鎖(latch)電路來達到此多工訊號選擇功能，更進一步瞭解個別微機電元件特徵及操作，符合該微機電元件之驅動電路，結合特殊的微機電元件特徵設計，噴墨列印解析度及列印速度要求越高，噴孔數一定會相對增加，熱氣泡微結構內墨水底下是一熱電阻，在幾微秒內即可迅速加熱達攝氏350~450度，整個晶片在同週期內要多噴嘴數同時噴墨，需要數十個週期內掃描完要噴墨噴孔，邏輯多工資料多區段處理訊號。在熱光光開關製程元件的熱環阻值誤差會直接影響到將來實際驅動所產生出的溫度不一樣，所以用不同驅動波形頻率不同振幅電壓來作調整。LED背光模組分成數個區塊，針對這數個區塊個別亮暗控制，可透過三維多工控制位址訊號和各組啟動訊號之任意組合而達到LED模組電路的驅動控制，換言之，每一LED模組電路係透過一位址訊號和各組啟動訊號中之一啟動訊號的控制而驅動，並可應用於立體顯示器背光對比控制。驅動與控制電路已成功利用Workview Digtial and Analog Circuit Design Tooling 軟體針對單元控制器進行設計、分析及模擬。電路部份則使用MaxPlusΠ製作FPGA 在邏輯數位電路上的驗證及Altera等設計軟體。系統驅動電路訊號與電壓調整電路訊號設計以HSPICE 軟體模擬，設計分析完成送國家晶片製作中心(CIC)晶片化，晶片量測結果同預期節省原本驅動與控制時間3倍以上精確定址(Addressing)，元件的特徵與原設計模擬同值。

第一章 介紹 14
1.1 理論背景 14
1.2 研究動機 16
1.2.1 噴墨陣列晶片控制應用 17
1.2.2 熱光光開關陣列晶片控制應用 18
1.2.3 液晶平面顯示器LED背光控制應用 19
1.3 論文架構 20
第二章 三維多工驅動架構 21
2.1 架構簡介 21
第三章 噴墨陣列元件控制驅動電路 25
3.1 三維多工驅動架構應用噴墨晶片 25
3.2 積體化三維多工噴墨晶片電路技術 26
3.2.1 相關研究發展現況 26
3.2.2 控制驅動噴墨印頭研究動機 40
3.2.3 控制噴墨印頭設計流程 44
3.2.4 模擬結果 45
3.3 多工控制驅動噴墨晶片電路設計 49
第四章 光通訊熱光光開關陣列元件驅動與控制電路 68
4.1 相關研究發展現況 71
4.1.1熱光效應開關的原理 72
4.1.2實現ROADM模組 85
4.2 研究動機 90
4.3 架構簡介 101
第五章 LED背光驅動電路 109
5.1 輸出級LED功率消耗 112
5.2 三維多工驅動面板背光控制電路 116
5.3 Gate Driver及Source Driver陣列控制 129
5.3.1其他元件控制 133
5.3.2時序控制模組的結構 134
5.3.3目前LED背光應用 139
5.4 智慧型掃描式背光（Smart Scan Backlight） 141
5.5 LED背光控制電路 144
5.6 LED光源未來更前瞻應用 158
第六章 設計流程與電路模擬 162
6.1 設計流程 162
6.2 電路模擬與結果 166
6.3 Multiplexer電路佈局設計 180
6.4 預計規格列表 183
第七章 結果與討論 185
7.1 測試考量 185
7.2 測試結果 185
7.3 噴墨晶片應用結果 191
7.4 熱光光開關陣列元件驅動應用結果 198
7.5 LED 背光面板顯示器應用結果 220
7.6 討論 228
第八章 未來規劃 229
References 230

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