本實驗以不同大小、不同體積分率之原生鑽石(Saw Diamond)製作高導熱的鑽石銀基複材，實驗中發現鑽石與銀基材的界面接合不佳，且不會有化學鍵結出現，使得鑽石銀基複材的熱傳導性質遇到瓶頸，因此希望藉由添加容易生成碳化物的鈦來改善基材與強化材間的界面，進而改善複材性質。
以3D懸臂式混粉機將鑽石與銀兩種粉末進行混合分散，接著採用大氣熱壓法，在600 ℃、500 MPa壓力下熱壓30分鐘後製成圓板狀試片，量測其熱傳導、熱膨脹、硬度等性質，並觀察其熱性質變化趨勢，評估此複合材料在電子構裝散熱材的應用潛力。
鑽石銀基複材截面於SEM下可看到鑽石均勻分佈之圖像，添加了鈦之後也可以清楚看見三種元素的相。在銀添加30 vol%之100 ~ 120 μm鑽石之複材中，可得到熱傳導係數為500 W/m•K；而添加了鈦之後熱傳導係數更可以提升到525 W/m•K，除了明顯比純銀(430 W/m•K)高出許多之外，也証明了鈦的添加的確有助於複材的熱性質。
在不同的鑽石含量與鑽石顆粒大小實驗中，可發現隨著鑽石顆粒尺寸變大，總表面積減少，熱傳導係數上升；而鑽石含量增加，在低體積分率時複材熱傳導係數上升，但當體積分率更高之後複材熱傳導係數反而下降，推測與緻密度較差有關。而熱膨脹係數方面，隨著鑽石體積分率上升，熱膨脹係數僅有微微下降的趨勢，應與界面無穩固的化學鍵結(Chemical bonding)，且原生鑽石較碎裂鑽石表面平滑無機械鍵結(Mechanical Interlocking)有關。硬度方面，則隨著鑽石體積分率上升，鑽石提供散佈強化的作用而有稍微上升，但趨勢上看不出與熱傳導性質有相關。
整體而言，以此法製造鑽石銀基複合材，製程設備便宜，硬度跟熱傳導係數都能隨著鑽石及鈦的添加而改善。

目錄
摘要 I
誌謝 III
目錄 V
圖目錄 VIII
表目錄 XII

壹、 前言 1
貳、 文獻回顧 3
2.1 散熱的重要性 5
2.2 散熱材料發展 8
2.2.1 傳統封裝散熱材料 8
2.2.2 先進散熱材料 10
2.2.3 散熱材料整合 14
2.3 金屬基複合材料 16
2.4 合金元素添加對熱傳導係數的影響 23
2.4.1 界面反應性 23
2.4.2 添加Si元素對熱傳導係數的影響 31
2.4.3 添加Cr、B元素的影響 33
2.4.4 合金元素反應層厚度 34
參、 實驗方法與步驟 39
3.1 實驗設計與流程 39
3.2 乾式混粉 44
3.3 大氣粉末熱壓法 44
3.4 複合材料性質分析 46
3.4.1 金相觀察 46
3.4.2 緻密度量測 46
3.4.3 硬度測試 47
3.4.4 熱膨脹係數量測 47
3.4.5 熱傳導係數量測 48
肆、 結果與討論 51
4.1 濕式球磨前粉末觀察 51
4.1.1 鑽石微結構觀察 51
4.1.2 銀粉與鈦粉 51
4.2 大氣熱壓複材微結構觀察 55
4.3 複材結構鑑定-XRD分析 66
4.4 鑽石銀基複材性質量測 70
4.4.1 緻密度 70
4.4.2 熱傳導係數 75
4.4.3 緻密度對熱傳導係數之影響 80
4.4.4 熱傳導係數與界面熱導之關係 86
4.4.5 熱膨脹性質 93
4.4.6 硬度 101
伍、 結論 104
陸、 未來研究方向 106
柒、 參考文獻 107
捌、 附錄 115
8.1 液相浸透法 115

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