現今在晶片封裝中最廣為使用的系統整合技術不外乎是系統單晶片(System on Chip, SoC)和系統級封裝(System in Package, SiP)。本研究以系統級封裝(SiP)之三維異質整合晶片模組為探討對象，並以單晶矽為穿晶片導線、玻璃材料(Pyrex 7740)為載台。首先以有限單元分析模擬軟體ANSYS探討三維玻璃載台內嵌矽導線在製程中由高溫降至室溫後載台中的殘留熱應力，並使用田口法(Taguchi method)來找出玻璃載台結構的最佳幾何參數，減少高溫製程所產生的殘留熱應力，以降低在往後製程中發生破壞的可能性。結果顯示由田口法所得之最佳參數水準組合可使玻璃載台中矽材料的最大von Mises應力值下降13.39%；也可使玻璃材料的最大von Mises應力值下降10.43%。文中也分析整體晶片模組結構在運作時系統中各元件的熱應力和溫度場分布情形。最後建立出一套分析流程，並且使用紅外線熱像儀量測晶片模組運作時，元件的表面溫度分布與熱傳分析之結果趨勢一致，藉以驗證數值模型分析之正確性。

目 錄
摘 要 i
目 錄 iv
第一章　緒論 1
1.1 研究動機 1
1.2 文獻回顧 2
1.2.1 球柵陣列和塑封球柵陣列封裝之可靠度探討 2
1.2.2 覆晶封裝和晶圓級封裝之研究 3
1.2.3 穿晶片導線的製程與研究 3
1.2.4 三維堆疊封裝的研究 4
1.2.5 以玻璃材料為載台之封裝研究 5
1.2.6 微尺度鎳之機械性質研究 5
1.3 研究主題 6
第二章　有限單元分析與設計最佳化理論 7
2.1 有限單元分析 7
2.2 熱應力分析 9
2.3 熱傳分析 10
2.4 最佳化理論 13
2.5 田口法(Taguchi method) 14
2.5.1 信號雜訊比(Signal to Noise Ratio, S/N ratio) 14
2.5.2 平均值 16
第三章　實驗設備與步驟 17
3.1 玻璃拉伸實驗 17
3.1.1 實驗設備 17
3.1.2 實驗步驟 19
3.2 紅外線熱像儀溫度量測實驗 21
3.2.1 實驗設備 21
3.2.2 實驗步驟 22
第四章　玻璃載台內嵌矽導線之分析結果與討論 24
4.1 玻璃載台內嵌矽導線製程殘留熱應力之模擬 24
4.1.1 有限單元分析 24
4.1.2 田口法 25
4.2 玻璃材料單軸拉伸試驗 27
4.3 玻璃載台內嵌矽導線分析結果 28
第五章　三維異質整合晶片整體模組之分析結果與討論 29
5.1 晶片整體模組熱分析 29
5.2 晶片整體模組熱-結構分析 30
5.3 微掃描面鏡模組熱分析 31
5.4 紅外線熱像儀實驗結果 31
第六章　結論 32
參考文獻 33

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