|
1. Kenichi Namba, Naoki Kimura, Jun Niekawa, Yuichi Kimura, Nobuyuki Hashimoto, ” Heat-Pipes for Electronic Devices Cooling and Evaluation of Their Thermal Performance ”, IEEE, InterSociety Conference on Thermal Phenomena, pp.456-459,1998. 2. Ioan Sauciuc, “ The Design and Testing of the Super Fiber Heat pipes for Electronics Cooling ”, IEEE, Sixteenth IEEE SEMI-THERM, pp.27-32, 2000. 3. V. Maziuk, “Miniature heat-pipe thermal performance prediction tool software development “, Applied Thermal Engineering 21(2001) 559-571. 4. Seok Hwman Moon, “Experimental Study on the Performance of Miniature Heat Pipes With Woven-Wire Wick”, IEEE Transaction on components and packing technologies,24, No. 4, 1521-3331, December 2001 5. Lanchao Lin, Rengasamy Ponnappan, John Leland “High performance miniature heat pipe” International Journal of Heat and Mass Transfer, Volume 45, Issue 15, July 2002, Pages 3131-3142 6. Kwang-Soo Kim, ” Heat pipe cooling technology for desktop PC CPU ”, Applied Thermal Engineering 23 (2003) 1137-1144. 7. Yasumi Sasaki, Yuichi Kimura, Kenichi Namba, ”The ultra-thin sheet-shaped heat pipe “Pera-flex” ”, 13th International Heat Pipe Conference (13th IHPC), pp250-255, 2004 8. T. Kaya, R. Pérez, C. Gregori, A. Torres “Numerical simulation of transient operation of loop heat pipes” Applied Thermal Engineering, Volume 28, Issues 8-9, June 2008, Pages 967-974
9. Ioffe, A. F., Semiconductor Thermoelements and Thermoelectric Cooling, Infosearch, London, 1957. 10. Goldsmid, H. J., The use of semiconductors in thermoelectric refrigeration, Research Laboratories, The General Electric Co. Ltd, Wembley, Middlesex, 1954. 11. Chu, R. C., 2000, “Application of Thermoelectric Cooling to Electric Equipment:A Review and Analysis,’ Semiconductor Thermal Measurement and Management Symposium, pp.1-9, 2000. 12. Solbrekken, G. L., K. Yazawa, and A. Bar-Cohen, 2003, Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices, Proceedings of InterPack 2003, Maui, HA, Jul 6-11, Paper IPACK2003-35305. 13. Jim Bierschenk, Dwight Johnson, Extending the Limits of Air Cooling with Thermoelectrically Enhanced, Thermal and Thermomechanical Phenomena in Electronic Systems, Vol.1, pp.679-684, 2004. 14. Ikeda, M.; Nakamura, T.; Kimura, Y.; Noda, H.; Sauciuc, I.; Erturk, H.,Thermal Performance of Thermoelectric Cooler (TEC) Integrated Heat Sink and Optimizing Structure for Low Acoustic Noise / Power Consumption, Semiconductor Thermal Measurement and Management Symposium, pp144-151, 2006. 15. Reiyu Chein, Thermoelectric cooler application in electronic cooling, Applied Thermal Engineering, Vol.24, pp.2207–2217, 2004. 16. B.J. Huang, System dynamic model and temperature control of a thermoelectric cooler, International Journal of Refrigeration, Vol.23, pp.197-207, 2000. 17. Tadayon, P., “Thermal Challenge During Micro- processor Testing,” Intel Tech. J., Q3, 2000. 18. Frank Kreith, Mark S. Boh “Principles of Heat Transfer 2001 Books/Cole” 19. Maidanik,Y.F.,Vershinin, Kholodov, V., and J. Dolgirev, “Heat Transfer Apparatus,” U.S. Patent No. 4515209, 1985 20. Yunus A. Cengel., 1998 “Heat Transfer”, McGraw-Hill. 21. Wei-Keng Lin, Bao-Shi Pei. “A Study on Heat Transfer Effect to the Trapezoid Grooved Heat Pipe in Micro Gravity (I)”, NSC 83- 0401- E007- 008. 22. Hung-Wen Lin, Yi-Xiang Zheng, Wei-Keng Lin, Tong-Bou Chang, "An Axial Heat Conduction Model to Predict the Maximum Heat Removed of the Miniature Heat Pipe", Transactions of the Aeronautical and Astronautical Society of the Republic of China, 35, No.4, pp393-400, 2003 23. Yao-Chen Chan, Hung-Wen Lin, Wei-Keng Lin,” Dynamic Tracing Method to Examine Maximum Heat Dissipate Ability of Heat-Pipe” 13th International Heat Pipe Conference (13th IHPC), pp311-316, 2004 24. 林鴻文,” 微型熱管系統散熱實驗與最大熱傳量之理論模式建立”,國立清華大學工程與系統科學系碩士論文,2003。 25. 洪佳煌,”熱管性能量測平台之靈敏度分析”,國立清華大學工程與系統科學研究所碩士論文,七月2008。 26. 林昆標,”熱電致冷器之三維暫態模擬分析”,國立成功大學機械工程學系碩士論文,2004。 27. 王威翔,”散熱器對熱電致冷器之性能影響”,國立交通大學機械工程學系碩士論文,2008。 28. 鄭憶湘,” 散熱片在強制對流下之最佳化設計與實驗”, 國立清華大學工程與系統科學研究所碩士論文,2002。 29. 盧俊彰,”影響熱管最大熱傳量之參數設計與分析”, 國立清華大學工程與系統科學研究所博士論文,2009。
|