酚甲醛樹脂改良之廢亞硫酸廢液製造方薄片形粒片板之性質

The Properties of Waferboard Bonded With Mixture of PF Resin and Modified SSL

彭武財(W. T. Peng)

《林產工業》 14卷4期 (1995/12) Pp. 629-637

摘要

由酚甲醛樹脂膠合劑及三種不同混合比之乙醇改良過之廢亞硫酸木質素膠著之方薄片粒片板（總用膠量為乾木重之2.5%）在本研究室中製成。其預定密度為0.689（43.01bs/ft3）。所有之機械及物理特性然後加以求出並比較之。以此改良之廢亞硫酸木質素作為酚樹脂膠合劑之代用材料最高祇能在2.5%之總用膠量下使用到30%，亦即PF/Lignin之70/30比而已。依照品管觀點視之，較適當且安全之混合比應以10~20%為限界。在工業規模生產之觀點言之，過多之乙醇改良之廢亞硫酸木質素之供用不僅使生產出之板類特性降低，且易引起產品在較潮濕之條件下會發生多量之劣化甚至崩壞現象。

關鍵字

方薄片粒片板、酚甲醛樹脂、乙醇改良之廢亞硫酸木質素、扭剪試驗、尿甲醛樹脂、樹脂代用材料。

並列摘要

Waferboards bonded with PF resin and other three different combinations of alcoholic base spent sulphite lignin (total binder content was 2.5% of dry wood weight) were manufactured. The density was targeted to 43.01bs/ft3 (0.69 g/cm^3). Their mechanical and physical properties were then determined and compared. The using of modified SSL as a type of substitute for PF resin can only be applied to the maximum of 30% (or 70/30 of PF/Lignin ratio) when the total binder content was set to 2.5%. The most feasible and safe margin of its application according to the views of quality control, the said SSL should be applied in around 10-20%. The excessive application in the industry scale not only weakening the properties of boards produced, but also could cause many degradated or even collapsed products when they were exposed in the wet condition.

並列關鍵字

waferboard ； phenol formaldehyde resin ； alcohol modified spent sulfite lignin ； torque-shear test ； urea formaldehyde resin ； resin substitute