本文在闡述微系統工程(MEMS),鎳鐵合金鍍液的表面張力對電鑄微結構性質的影響。在高深寬比(深210μm,寬度僅有7μm)的微孔內進行電鑄程序,可以製造出鎳鐵合金的微結構。結構的內應力與表面完整性會受到鍍液內界面活性劑以及電流密度所影響。藉由界面活性劑的添加輔以控制適當的電流密度,即可藉由電鍍本身所伴隨的析氫反應,來促進微孔內的流動性質,用以減少微孔內由於電化學反應所造成的pH值變化。
The effect of electrolyte's surface tension on Ni-Fe codeposition for MEMS application was studied. A nickel-iron microstructure was obtained inside high-aspect-ratio(210μm deep with 7μm width) microchannel. The internal stress and surface defect of the alloy microstructure are influenced by the presence of surfactant and applied current. Uniform distribution of deposit inside microstructure can be achieved by choosing proper current, surfactant and optimal control of hydrogen evolution reaction which can induce agitation and mitigate pH variation during electrodeposition.
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