添加Ti元素對無鉛銲錫Sn3.5Ag0.5Cu合金顯微組織及微硬度之影響

Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy

朱中平(C. P. Chu) ； 曹龍泉(L .C. Tsao)

《鑄造工程學刊》 37卷2期 (2011/06) Pp. 29-34

https://doi.org/10.29809/JTFS.201106.0004

摘要

本研究是針對添加微量鈦(Ti)於無鉛銲錫Sn35Ag0.5Cu合之微觀結構與微硬度的影響。結果顯示，添加微量Ti於無鉛銲錫Sn3.5Ag0.5Cu合金內能達到細化初晶β-Sn、抑制Ag3Sn相的粗大化，以及增加共晶組織面積率。相較於Sn3.5Ag0.5Cu合金，添加Ti於Sn3.5Ag0.5Cu-XTi合金能提高微硬度約8.3至19.6%，此影響效果相當符合Hall-Petch關係式。

關鍵字

Sn3.5Ag0.5Cu ； 鈦 ； 顯微組織 ； 微硬度

並列摘要

Effects of minor Ti additives on the microstructure and microhardness of Sn3.5Ag0.5Ci alloys were investigated in this study. Results indicate that the addition of Ti into the Sn3.5Ag0.5Cu alloy refined the size of β-Sn grains, restrained the formation of bulk Ag3Sn intermetallic compounds (IMCs) and extended volume fraction of eutectic area. The addition of Ti could enhance the microhardness of Sn3.5Ag0.5CU-xTi solder by 18.4% compared with the Sn3.5Ag0.5Cu solder matrix. The microhardness of the obtained the Sn3.5Ag0.5Cu-XTi solder alloys fits well with the Hall-Petch relationship.

並列關鍵字

Sn3.5Ag0.5Cu ； Ti ； Microstructure ； Microhardness