Contactless Testing for Pre-bond Interposers with Package-aware Thermal Simulations

具有封裝感知熱模擬之非接觸式中介層測試

Jui-Hung Chien ； Hsueh-Ju Lin ； Chiao-Ling Lung ； Ruei-Siang Hsu ； Ka-Yi Yeh ； Shih-Chieh Chang

《電腦與通訊》 157期 (2014/06) Pp. 53-60

並列摘要

In this paper, we study the testing flow in fabrication process of stacked-die products. We discuss the difficulties of traditional testing mechanism. To improve production yield, a contactless testing mechanism for pre-bond interposers is proposed in this paper. We propose a testing framework comprising a heating laser and an infrared-radiation camera. In addition, we also build a completely correct model of a functional interposer. By our proposed Classification Algorithm and BDA classifier, functional and defective interposers can be differentiated. Our experimental results show that the proposed framework provides an over 97% accuracy to identify functional interposers from a whole batch of untested products.

並列關鍵字

3D-IC ； Interposer ； Testing ； Thermal Analysis