應用異方性導電膠於覆晶構裝中之熱行為分析研究

Analysis and Study of the Thermal Behaviors of Flip Chip Package with Anisotropic Conductive Films

鄭江河(Chiang-Ho Cheng) ； 莊賀喬(Ho-Chiao Chuang) ； 趙容適(Jung-Shih Chao) ； 鍾培原(Pei-Yuan Chung)

《大葉學報》 9卷2期 (2000/12) Pp. 61-68

https://doi.org/10.7119/JDYU.200012.0061

摘要

電子構裝技術中晶片與基板間的導通方式大致可歸納成三種型式，包括有：打線接合（wirebonding）、捲帶自動接合TAB（tape automated bonding）以及覆晶構裝（flip chip）等三種方式。隨著電子產品朝輕薄短小化、高速度化、高效能化以及低價化的趨勢發展，覆晶構裝技術已成為構裝連接導通的主要架構。覆晶構裝技術中的導通方式大致可歸納成金屬導通、導電膠、微凸塊接合（MBB）導通、異方性導電膠及導電性樹脂等導通方式，其中目前最常被使用的方式主要有金屬導通與異方性導通兩種方式。而本文將採用有限元素分析的方法，並配合有限元素分析的軟體ANSYS針對覆晶構裝技術中，以異方性導電膠及導電粒子所構裝之半導體元件因受熱而產生溫度變化時的應力及應變，做一完整的分析與探討。此外，也將針對兩種不同型式的導電粒子即鎳球與樹脂披覆一層鎳，做不同參數的分析與比較。本文透過分析技術的運用，探討用異方性導電膠來做覆晶構裝時，當IC晶片溫度上昇至80℃時，在各個主要結構如IC晶片、基板、金凸塊、鋁電極、異方性導電膠等所產生之變形、應力、應變、翹曲等熱行為，並改變不同參數以探討整體結構的翹曲變形量與最大應力值之相對變化關係。因此，本文之分析可提供構裝業者在構裝元件設計上之參考，方便找出最佳之構裝方式，並降低成本，深具實用價值。

關鍵字

覆晶 ； 異方性導電膠 ； 熱行為 ； 有限元素分析

並列摘要

In electronic packaging techniques, there are three methods of conducting between IC chip and substrate. That is Wire Bonding, Tape Automated Bonding and Flip Chip. With the development of electronic products toward smaller size, higher speed, higher effect and lower price. The Flip Chip techniques have already become the major structure of conducting. The method of conduction of Flip Chip techniques could be induced to Metal conduction, Conductive adhesive, Micro Bump Bonding (MBB) conduction, Anisotropic conductive film and electric conduct resin. At present, the mostly used method is Metal conduction and Anisotropic conduction.In this study, we do a complete analysis and research about the stress and strain from the temperature variations within semiconductor parts that packaging with the Anisotropic conductive films and the conductor. In addition, we analysis and compare the different parameters of two different kinds of conductors, Nickel ball and Ni-coated polymer ball. By using the analysis technique, when the temperature of the IC chip increased to 80℃, we study the thermal behaviors including deformation, stress, strain and warpage by the major structure, IC chip, substrate, Au bump, Al Electrode and Anisotropic conductive films. We also study the opposite type of relationship between the warpage and maximum stress of the entire structure by changing different parameters. Therefore, the analysis of this paper may provide a reference for package competitors for designing the package parts, and the convenience looks for out the best package method and cost reduction is of practical, useful value.

並列關鍵字

flip chip ； anisotropic conductive film ； thermal behavior ； finite element method