The paper is to design the capillary pumped loop which dimension is 4.2(superscript *) 3.8(superscript *) 0.8 cm^3 for cooling of high end electronic components chips (such as CPU). The heat transport characteristics of capillary pumped loops are obtained from experimental results. The results shown that: (1) the loop could dissipate heat 40W and keep the surface temperature of chip under 100℃ under relative height 7.5 cm; (2) the loop could transfer heat for a distance from evaporator to condenser separated by natural circulation without any external driving forces if the relative height (evaporator and condenser position) higher than 1 cm; (3) through the semi-transparent loop design, some transport phenomena of the working fluid could be observed; (4) the relation between optimal inventory with thermal resistance of the loop.