本研究以印刷電路板生產的鑽孔流程爲研究範圍,將國內外相關文獻所提出之管理改善工具和方法,加以整理、歸納及篩選,並應用六標準差(six sigma)改善技術,進行鑽孔作業製程能力提升的探討。最後,透過整體設備效率(Overall Equipment Efficiency, OEE)驗證在製程生產力提升的同時,是否同時兼顧時間稼動、設備稼動及產品良率,使整體設備效率達到最佳。本研究所提出之六標準差改善模型,涵蓋了「品質基石、企業經營者的決心、執行力的落實」三個啟動改善循環的要素。三者在持續不斷改善演進後,將自然形成驅動改善活動的動力,成爲企業文化。在模型驗證部分,本研究以一家電子公司在台灣區的單一流程作業廠區作爲研究對象,評估結果以整體設備效率分析顯示各項指標皆達到設定基準且變異縮小。
The main purpose of this study is to examine the improving drilling capabilities using the six sigma method, particularly in the Printed Circuit Board (PCB) industry. Based on previous academic and practical research, this study proposes overall equipment efficiency (OEE) as a method of examining the outcome of the main indicators when considering productivity, utilization, efficiency, yield rate, and so on. The six sigma improvement model includes three key elements of improving circulation, namely: the foundation of quality, managerial resolution, and execution implementation. To verify the six sigma improvement model, this study examines the drilling process of company U. The results indicate that main indicators reach expectations and the process variance can be reduced. Based on the results, practical implications of this study are also discussed.