積體電路晶圓製造逆向思維之規劃與控制技術

Planning and Controlling Techniques Directed by Reversed-thinking in the IC Wafer Fabrication

劉力(Li Liu)

《東海科學》 7期 (2005/07) Pp. 15-30

https://doi.org/10.29723/TS.200507.0002

摘要

積體電路晶圓製造之整體規劃與控制的架構及其相關的技術是十分複雜的。傳統的作法為先有上層的資源規劃與需求管理，之後衍生中層的主生產排程和細部生產排程，再由下層的現場流控的設計嘗試完成中層之排程所交代下來的構想。這一方面的技術，在遇到機器不預期的當機或維修的狀況時，不容易交代得清楚。本文以反向思考的方式，首先設計一種傳統架構上屬於下層的，具有自主性，簡單而有效率，晶圓釋放基於在製品參數，晶圓派工基於製程時間區間內晶圓數的現場流控的技術。之後，撰寫此一技術下作業系統的模擬的程式；並用輸出的數據決定系統最適當表現的一些參數值。再以這些參數值的作業系統之產能為基礎，提出傳統架構之屬於上層的資源規劃與需求管理方面的一些問題的對策。我們的作法比傳統的階層式的技術簡單了許多；現場流控若遇當機狀況順其自然，無傳統技術為了執行上層構想所碰到的問題；而實驗性質系統表現方面的模擬的數據，亦顯示這樣的作法有好的潛力達成積體電路廠之降低生產成本和提高服務品質的營運的目標。樂見此類逆向思維整體技術的進一步地研究與發展。

關鍵字

積體電路 ； 晶圓製造 ； 規劃 ； 控制 ； 架構 ； 逆向思維 ； 自主性流控技術 ； 潛力

並列摘要

The fabrication of IC wafers involves very complicated structure of planning and controlling as well as its related technologies. The traditional way of handing this fabrication can be divided into three levels. Included in the top level are resource planning and demand management. This overall planning would guide the development of the main and detailed scheduling of the production, labeled as middle level. The final level is to finish the work set by the middle level by means of flow control arrangement on the spot. The technical problems of the traditional methods would not be easily revealed when encountering unexpected shot-down or when the machines are under work of maintenance. This paper presents a different planning and control structure created by reversed thinking. First, we design a flow control arrangement on the spot which is independent, simple, and efficient. The wafer releasing policy is based on the so-called WIP parameter and the wafer-dispatching policy is on the basis of counting possible wafers in the respective process-time intervals for wafers in the queue. Then, the data of simulation runs applying this arrangement in the operating system are recorded. The output is used to determine the most proper WIP parameter value that best displays the system. Also, with these data as foundation, strategies are developed to resolve issues that are handled in traditionally upper level. Our approach is much simpler than the traditional type of layered-technologies. The technique would let the flow take its own course when some machines are shut down without encountering the problems which would have encountered in the traditionally lower level structure. The experimental-simulation result shows that our approach have good potential to achieve the goals of reducing production cost and increasing service quality for integrated circuit firms. Further research and development on this reversed thinking technology is expected with pleasure.

並列關鍵字

integrated circuit ； production of wafers ； planning ； controlling ； structure ； reversed-thinking ； independent flow-control technique ； potential