本研究提出增強型均溫板熱管鰭片(Extended Vapor Chamber Heat Sink簡稱EVC),透過SolidWorks Flow Simulation數值模擬分析此EVC散熱模組之熱性能,進而找出最合適的散熱設計。本文比較了不同等效熱傳導係數的新型EVC熱管鰭片散熱模組、傳統均溫板加上純銅實心鰭片散熱模組以及純銅實心鰭片散熱模組之熱性能。結果顯示,所有散熱模組之熱性能都隨著鰭管直徑、鰭管高度及鰭管間距的增大而提高。此外,不論發熱量的高低,新型EVC散熱模組的熱性能都優於其他兩種散熱模組。本文同時也探討了鰭管高度及鰭管間距對散熱效果的影響,並試圖找出散熱模組的較佳設計。結果顯示,當EVC在鰭管高度70 mm及鰭管間距5 mm的情況下,鰭管直徑超過14 mm時將趨近於最小穩定熱阻1.65 ℃/W;而在鰭管高度50 mm,鰭管直徑8 mm時,鰭管間距超過10 mm後將趨近於最小穩定熱阻2.51 ℃/W。
This paper presents a numerical study on the thermal performance of heat dissipation devices. A vapor chamber and a heat sink are merged into a novel device, called Extended Vapor Chamber. A commercial software, SolidWorks Flow Simulation 2010, is employed to analysis the heat transfer behavior in the new device, and then to find out the optimal thermal design. Thermal performances of Extended Vapor Chamber with various effective thermal conductivities, the combination of a traditional vapor chamber and a solid copper heat sink, and purely solid copper heat sinks are compared in this study. The results show that thermal performances will increase with increasing diameter of fins, height of fins, and pitch between fins. Moreover, the thermal performance of Extended Vapor Chamber is always better than that of the combination of a traditional vapor chamber and a solid copper heat sink no matter what heat generation is applied. Furthermore, the effects of diameter of fins and pitch between fins on the thermal performance are also investigated. The results show that the thermal resistance is approaching to the lowest value as 1.65 ℃/W when the diameter of fins is greater than 14 mm. And the thermal resistance is approaching to the lowest value as 2.51 ℃/W while the pitch between fins is greater than 10 mm if the diameter and the height of fins are 8 mm and 50 mm, respectively.