- 期刊
The Forward-backward Buckling Motion of a Micro Strip through Thermal Loading
並列摘要
In this study a micrometer level component actuated via the thermal loading that induces forward and backward buckling phenomenon is tested via the finite element analysis (FEA). A branch of comparison is interpreted through the analytical closed forms. The characteristics embedded in the analytical closed forms could reflect on the finite element model for the micro-strip actuator. It's a start for the advanced investigation for practice applications.
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