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Optomechanical Design of Collimated UV Source Module
並列摘要
This paper presents a UV (ultraviolet) lithography apparatus that utilizes an array composed of UV-LED (light emitting diode) collimation modules as a micro-patterning light source for PCB (printed circuit board) fabrication. To provide a uniform (non-uniformity ＞ 90%) and collimated (FWHM ＜ ±2°) exposure area, hexagonal light source modules are disposed in a hexagonal array. Each module is consisted of a LED chip, a biconvex lens to enhance UV collimation and uniformity, and a hexagonal sidewall to absorb the side propagation UV light. The whole exposure system is thus composed a layer of heat sink (made of a copper cooling plate), a plurality of UV-LEDs disposed in an array, a baffle wall extending between UV-LED and the respective plurality of collimating lenses.
被引用紀錄
延伸閱讀
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