本研究係採用Ti(OBu)_4/AlEt_3為觸媒進行聚乙炔膜及粉粒之合成。再以硫酸及碘分別進行摻雜作用。另一方面,利用PMMA高分子作包裹成形法,測定其導電率,確認此成形法對導電率之穩定性具有良好的效果。
Polymerization of acetylene gas was carried out in the presence of Ti(OBu)_4/AlEt3 mixture catalyst for polyacetylene film or powder, and then doped with H2 804 and Iodine respectively. On the other hand, the polyacetylene film or powder was using so called package molding method with polymethyl methacrylate (PMMA), and then it’s conductivity was measured, it was continued that a good stability of conductivity for this molded polyacetylene.