真空封裝電容感應式微型圓環陀螺儀之研製

Fabrication of a Vacuum Packaging Capacitive Sensor for Micro-Ring Gyroscope

林冠宇(Kuan-Yu Lin)

指導教授 ： 張家歐

共同指導教授 ： 張簡文添(Wen-Tian Chang Chien)

國立臺灣大學/工學院/應用力學研究所/碩士(2011年)

https://doi.org/10.6342/NTU.2011.10385

摘要

本文以微機電製程在(111)單晶矽晶圓上製作具有柵狀質量塊之環式振動陀螺儀，並以7740玻璃晶圓製作陀螺儀之基座與感應電極層。利用柵狀質量塊與感應電極層的差動運動，進行待測物體之轉動物理量量測。
由於(111)單晶矽晶圓為等向性材料，因此沒有頻率偏移問題；但其原子排列密度高，所以使用電感耦合電漿蝕刻機進行製程。其中，使用陽極接合法進行矽材與玻璃的接合，而陀螺儀的封裝係以覆單晶矽玻璃方式，並於真空環境中進行封裝。如此可確保陀螺儀內部為真空空間，使得環形振子的運動不受空氣阻力影響，增加陀螺儀的靈敏度。

關鍵字

陀螺儀 ； 微機電製程 ； 陽極接合 ； 電感耦合電漿蝕刻機 ； 覆單晶矽玻璃

並列摘要

In this research, a micro-ring vibratory gyroscope with grid-like masses was fabricated on a (111) single-crystal silicon wafer by MEMS technology. The base and the electrode sensing layer of the gyroscope were fabricated with Corning Pyrex #7740 glasses. The gyroscope can be used to measure any object’s rotational information through differential motions between grid-like masses and the electrode sensing layer.
The frequency-offset problem was solved by using (111) silicon to fabricate the gyroscope. However, due to the high density of atomic arrangement in (111) silicon, fabricating processes were difficult. The ICP was used to fabricate the main part of the gyroscope and ring oscillator. The anodic bonging process was used to bond (111) silicon and glasses. The SiOG process was used for the gyroscope packaging process. To ensure the internal part of gyroscope was in vacuum, the SiOG process must be done under vacuum environment. With such procedure, interferences between air resistances and ring oscillator’s motions can be avoided, and the sensitivity of the gyroscope can be enhanced.

並列關鍵字

Gyroscope ； MEMS process ； anodic bonding ； ICP ； SiOG process

參考文獻

[17]吳裕隆, “微型矽材之諧振式陀螺儀調質薄膜設計與製作,” 國立臺灣大學應用力學研究所碩士論文, 2004.

[7]王毓斌, “非等向性矽材環式振動陀螺儀之研製,” 國立臺灣大學應用力學研究所碩士論文, 2007.

[18]謝盛祺, “厚膜光阻AZ4620 之最佳化製程在微機電上應用,” 崑山科技大學電機工程系碩士論文, 2004.

[6]沈家豪, “微型(100)矽晶圓環陀螺儀之振動分析與最佳化設計,” 國立臺灣大學應用力學研究所碩士論文, 2006.

[3]A. J. Harris, J. S. Burdess, D. Wood, R. Langford, G. Williams, M. C. L. Ward, M. E. McNie, “Issues associated with the design, fabrication and testing of a crystalline silicon ring gyroscope with electromagnetic actuation and sensing,” J. Micromech. Microeng. 8 (1998), pp. 284–292.