超微細錫球覆晶組裝之可靠度分析

Reliability Analyses of Flip Chip Assembly with Micro-Solder Balls

張文華(Wen-Hua Chang)

指導教授 ： 莊東漢

國立臺灣大學/工學院/材料科學與工程學研究所/碩士(2013年)

https://doi.org/10.6342/NTU.2013.10901

摘要

隨著高階應用跟輕薄型的電子產品蓬勃發展，產品內部構造比以往更加的密集與複雜化，近年來晶圓等級的高密度封裝技術正積極發展中。
微細錫球微凸塊為晶圓封裝技術未來應用的主流之一，作為電子產品中覆晶連線的凸塊可避開傳統製程的缺點，能有效的增加I/O數、縮小間距、簡化製程與降低成本，對於應用在晶圓等級的高密度封裝及具有發展潛力與優勢。
本研究包含微細錫球的製造、植球之界面反應、覆晶組裝之微結構觀察，並分別以微小負荷動態疲勞試驗與冷熱循環試驗針對微細錫球覆晶組裝之可靠度進行分析。以Sn-3Ag-0.5Cu與Sn-0.7Cu兩種微細錫球(90μm)作為覆晶凸塊的種類，與不同表面處理之基板(ENIG、OSP)進行覆晶組裝，組合為可靠度試驗的四種樣品。透過分析四組覆晶組裝樣品的疲勞壽命與破壞特徵，結果顯示動態疲勞試驗與冷熱循環的結果是一致，證實動態疲勞試驗可應用在電子產品的可靠度測試。相較於冷熱循環試驗，動態疲勞試驗不僅可簡化可靠度試驗過程還可以大幅縮短試驗時間，並達到相同的可靠度趨勢。

關鍵字

覆晶組裝 ； 微細錫球 ； 可靠度分析 ； 動態疲勞試驗 ； 界面反應

並列摘要

In recent years, the development trend of electronic products gets higher order application, and the internal structure of products is more intense than ever. High density packaging technology of wafer level is a positive development.
Micro solder ball used in wafer level package technology is a trend for the future applications. Using micro solder ball as bump of flip-chip can avoid the disadvantage of the traditional methods; it can effectively increase the number of I/Os, narrow bumping pitch, provide a low cost and high reliability method to the advanced packages, and be applied in high density packaging of wafer level with development potential and advantages.
This research includes micro solders ball manufacturing, ball placement process and the interfacial reactions of flip-chip assembly. Using dynamic fatigue test and thermal cycle test to analysis reliability of micro solder ball flip-chip assembly.
Use Sn-3Ag-0.5Cu and Sn-0.7Cu alloys as micro solder balls (90 μ m) of flip chip bumping, assemble these balls to different surface treatment substrates (ENIG, and OSP),and then test their reliability.
Through analyses the fatigue life and failure modes of four flip-chip assembly sample, dynamic fatigue test results are consistent with the results of thermal cycles test. It confirms that dynamic fatigue tests can be applied to the reliability test of electronic products. In contrast to the thermal cycles test, dynamic fatigue tests not only simplify the process of reliability test, but also significantly reduce testing time and achieve the same reliability trends.

並列關鍵字

flip-chip assembly ； micro solder balls ； reliability analysis ； dynamic fatigue testing ； interface reaction

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