5G使用者終端裝置毫米波頻段雙頻雙極化天線封裝(AiP)技術發展

Development of Dual-Band Dual-Polarized Antenna-in-Package (AiP) Technology for 5G User Terminal Application at Millimeter-Wave Frequencies

廖汝瑄(Ju-Hsuan Liao)

指導教授 ： 周錫增

國立臺灣大學/電機資訊學院/電信工程學研究所/碩士(2021年)

https://doi.org/10.6342/NTU202104158

摘要

本論文提出應用於第五代行動通訊(5G)之毫米波頻段天線，分別實現以28 GHz與39 GHz為中心頻率之單頻雙極化天線和滿足兩頻段的雙頻雙極化天線，透過對稱的印刷電路多層板(PCB)架構與低溫共燒陶瓷板材(Low Temperature Co-fired Ceramic, LTCC)，提供低介電常數及低損耗材料，形成小尺寸且具有良好特性之陣列天線封裝(Antenna-in-Package, AiP)，可以將其設計應用於使用者終端裝置當中。
天線單元設計以貼片天線為主，並以堆疊、挖除槽孔、電容耦合和添加寄生元件的方式進行設計，頻寬都能涵蓋整個目標頻段，且都具有線性雙極化特性，並提供2×2和4×4的天線陣列架構設計，本論文回顧相關設計文獻，並介紹設計理論，再提供天線單元設計流程，並將陣列天線設計模擬結果進行討論。

關鍵字

雙頻天線 ； 雙極化天線 ； 陣列天線 ； 封裝天線 ； 印刷電路多層板 ； 低溫共燒陶瓷板

並列摘要

This paper proposes a millimeter-wave band antenna applied to the fifth generation of mobile communications (5G), which realizes a single-band dual-polarized antenna with 28 GHz and 39 GHz as the center frequency and a dual-band dual-polarized antenna that meets two frequency bands. Through the symmetrical PCB multi-layer board structure and LTCC board, low dielectric constant and low loss materials are provided to form an array antenna package with small size and good characteristics, and its design can also be applied to user terminal applications.
The unit design is based on a patch antenna, and is designed by stacking, removing slots, capacitive coupling, and adding parasitic elements. The bandwidth can cover the entire target frequency band, and all have linear dual polarization characteristics, and provide antenna 2×2 and 4×4 array architecture design. This thesis reviews the relevant design literature, introduces the design theory, then gives the design process of the antenna unit, and discusses the simulation results of the array antenna design.

並列關鍵字

Dual-band antenna ； dual-polarized antenna ； antenna array ； antenna-in-package ； PCB multilayer ； low-temperature co-fired ceramic

參考文獻

[1] 3GPP Release 16 (July 2018). 3GPP The Mobile Broadband Standard [Online] Available: https://www.3gpp.org/release-16

[2] J. Wells, "Faster than fiber: The future of multi-G/s wireless," in IEEE Microwave Magazine, vol. 10, no. 3, pp. 104-112, May 2009.

[3] S. Salous et al., "Millimeter-Wave Propagation: Characterization and modeling toward fifth-generation systems. [Wireless Corner]," in IEEE Antennas and Propagation Magazine, vol. 58, no. 6, pp. 115-127, Dec. 2016.

[4] S. -C. Hsieh, F. -C. Chu, C. -Y. Ho, W. -Y. Chen and C. -C. Wang, "mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 114-119.

[5] S. Chen and A. Zhao, "LTCC Based Dual-Polarized Magneto-Electric Dipole Antenna for 5G Millimeter Wave Application," 2019 13th European Conference on Antennas and Propagation (EuCAP), 2019, pp. 1-4.