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  • 學位論文

散熱模組之氣泡泵性能分析研究

The Performance Investigation of Bubble Pump in Cooling System

指導教授 : 陳希立

摘要


隨著電子工業的發展,電子產品也不斷朝著高性能、小體積的方向發展,然而其單位面積的發熱量卻是越來越高,因而也就產生了散熱方面的問題,使得各種電子設備散熱系統因應而生。而近幾年來,利用工作流體之相變化快速帶走熱量的方式被廣泛應用在解決散熱問題上,另外目前市面上也常見需以泵浦產生循環動力的迴路型主動水冷散熱技術。本研究提出結合利用相變化來吸收熱量並利用沸騰產生的氣泡來帶動流體達成循環的概念,設計出一氣泡泵。 本研究針對氣泡泵本身的性能設計一套完整的實驗方法,研究不同底板、加熱功率、氣泡泵入口溫度對於氣泡泵性能的影響,並藉由可視化視窗來觀察腔體內部的沸騰情形,並將其工作狀況分為:(a)自然對流區、(b)過冷沸騰區及(c)飽和沸騰區,討論在不同區域內的熱源溫度、流量、熱對流係數的特性,發現其大致隨著加熱瓦數增加而升高,只有流量在飽和沸騰區內有峰值產生,本氣泡泵使用方正底板於飽和沸騰區內,加熱瓦數為30W時可以達到最大流量149g/min。最後將理論式與實驗結果做一結合,繪出本實驗之氣泡泵的性能曲線圖。

並列摘要


With the growth of electronic industry, electronic components become more powerful but the size of them tends to be smaller. It induces the challenge in thermal solution, and several kinds of electronic cooling methods are applied to conquer the thermal dissipation problem. In recent years, the applications of boiling-condensation heat transfer mechanism are widely used for the heat dissipation problem. Besides, the most common cooling method for electronic components like closed loop water-cooling system has to be driven by a pump. The present study is to design a bubble pump combining the ideas of taking away the heat using the latent heat of the working fluid and driving the system with bubbles formed through boiling. This paper establishes a set of experimental methods for the performance of the bubble pump. The influences of the different plate surfaces, heating power, inlet temperature to the performance of bubble pump are under evaluation. The boiling phenomenon is observed through the transparent cover of the chamber, and the result shows that the bubble pump has three states: (a) nature convection (b) subcooled boiling (c) saturated boiling. The results of the heater temperature, mass flow rate and convection heat transfer coefficient are discussed in each state, and they all increase to certain extent when the heating power increased except the maximum value of mass flow rate is found in the saturated boiling area. It is shown that the maximum mass flow rate is 149 g/min while using the plate with cavities in square array and the heating power is 30W. The mathematical model and the experimental results are integrated to generate the performance curve of the bubble pump.

參考文獻


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