透過您的圖書館登入
IP:3.235.251.99
  • 學位論文

高對稱性丙烯酸樹脂之合成與其應用於低介電奈米混成材料之研究

Synthesis of Highly Symmetrical Acrylate Resins and their Applications for Nano Hybrids with Low Dielectric Constant Materials

指導教授 : 謝國煌

摘要


本研究合成了三種雙壓克力官能基之單體與兩種雙丙烯基之單體,上述五種單體皆具有高對稱性與極性低之結構,之後將之與市售之雙壓克力單體三環癸烷二甲醇二甲基丙烯酸酯互相混合後進行紫外光聚合反應,製備出共聚高分子材料,由結果顯示材料因微相分離而使材料之結構較為不緊密,並且有較大之自由體積,因此能夠得到較低之材料介電常數,而當單體混合之重量百分比接近一時共聚高分子材料能夠有較低之介電常數,最低能達到2.36。本研究亦於材料中添加了具有丙烯酸酯官能基之多面體聚矽氧烷寡聚物,此類材料因其具有孔洞之結構,添加於高分子材料後能亦可增加材料之自由體積而使介電常數能夠降至更低,此外因無機相之增加,材料於熱性質或機械性質能夠加以改善,而由結果顯示,當添加5~10phr時,介電常數可降至2.02。本研究在樹脂部分亦混合部分單官能基之單體,並因材料交聯密度之降低而會有柔軟(flexible)之性質,可使材料能應用於軟性電子材料中。本研究以最製程簡便之紫外光聚合法成功製備了低介電常數之材料,將製備時間縮短且合成溫度降低,並且於製備過程中減少了有機溶劑之使用,而由結果顯示,材料除了有低介電常數之外在熱穩定性方面也相當不錯,其中之T50IAC10SQ1材料介電常數為2.02,且其5%裂解溫度在487ºC,實為極有潛力之低介電常數材料。

並列摘要


In this study, three difunctional acrylate monomers and two allyl monomers with high symmetry and low polarity were proposed and prepared. The obtained monomers were then purified and mixed with a difuntional acrylate monomer tricyclodecane dimethanol diacrylate(TDDA) to synthesize their homopolymers and copolymers by UV curing. The obtained materials have low dielectric constant about 2.36 because of the microphase separation of polymers. We can add the free space of the materials by microphase separation. After that, polyhedral oligomeric silsesquioxane (POSS) materials with acrylic functional groups were added into the polymers to form nano-hybrid materials. The dielectric constant of obtained nano-hybrid materials were found to be able to adjust from 2.36 to 2.0 for the cube structure of POSS. Besides, two kinds of monofuctional momomers were also used to prepare the copolymers. Because of the lower crosslinking density, the copolymers would have flexible property. The copolymers or hybrid materials not only have low dielectric constants but also have good thermal stability. The material T50IAc10SQ1 possessed low dielectric constant of 2.02 at 1MHz and high 5wt% degretation temperature (487ºC).

並列關鍵字

UV curing acrylate POSS low dielectric constants

參考文獻


64.黃慶怡, ”探究共聚合物系統之多元化結構衍變”, 物理雙月刊, 廿三卷四期, 2001.
3. S. P. Murarka, M. Eizenbe, A. K. Sinha, “Interlayer dielectris for semiconductor technologies”, ELSEVIER, 4-5, 2003.
1. J. M. Steven, P. G. James, E. M. Michael, O. S. Edward, H. T. Paul, “Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect”, Adv. Mater., 12, No. 23, December 1. 2001.
2. B. S. Nowick, A. S. Lee, K. W. Viehbeck, ”Sorption of water and organic solutes in polyimide films and its effects on dielectric properties”, Polym. Sci. Part B: Polym. Phys, 31, 545. 1993.
9. Y. Z. Wang, W. Y. Chen, C. C. Yang, F. C. Cheng, “Novel epoxy nanocomposite of low Dk introduced florine-containing POSS structure”, Journal of Polymer Science, Part B: Polymer Physics, Vol. 45, 502-501, 2007.

延伸閱讀