整合TRIZ與集群分析於底部填膠之陣列式電子元件重工製程研發

Development of Rework Process for the Underfilled Component based on Integration of TRIZ and Cluster Analysis

廖品柔(Pin-Jou Liao)

指導教授 ： 黃乾怡

國立臺北科技大學/管理學院/工業工程與管理系碩士班/碩士(2013年)

摘要

電子封裝技術逐漸邁向高功能密度及持續增加電子元件輸入輸出訊號點數，以達到現今電子產業之產品設計需求。對於可攜式電子產品而言，連接電子元件與印刷電路板(Printed Circuit Board; PCB)之錫球銲點可能因碰撞、震動或掉落等機械外力而斷裂，故以底膠緊密環繞並保護錫球(或凸塊)，使其得以承受上述機械外力(或熱應力)。當發生電子元件失效或銲點產生空洞、底膠未填滿、底膠氣泡比大於25%及底膠溢出等製程不良現象，皆需要進行重工。然而，由於底膠材料多為熱固性高分子聚合物，經烘烤固化後不易軟化，另由於電子元件及電路板耐高溫條件之限制，經底部填膠製程後之元件重工極為困難。
本研究利用TRIZ理論針對點膠後陣列式封裝電子元件，系統性地分析及解決問題，開發具備理想性之重工製程。在因果衝突鏈分析(CECCA)中，若使用者欠缺該領域之專業知識，於挑選工程參數時往往造成不佳之判定，且可能選擇多數個相關之工程參數，使得後續尋求解決方案時甚為耗時。本研究利用兩階段集群分析法(華德法與K平均法)分別針對矛盾矩陣表(CM/IP)中工程參數，以其所對應發明原則出現之次數進行分群。並提出集群化之矛盾矩陣表，再依各發明原則出現的次數進行排列，作為其選用之優先順序。最後，將此矛盾矩陣表應用於本案例之底膠元件重工製程，依照上述發明原則優先順序作為觸發解。結果顯示，本研究提出之集群化矛盾矩陣表成效優於Altshuller矛盾矩陣表，於本個案中額外產生兩組觸發解，經發想後提出「雷射聚焦移除電子元件」、「可重工之元件托座」及「可拆換式PCB」等底膠元件重工製程解決方案。進而評估各方案之理想性，並以最理想方案「可拆換式PCB」，申請中華民國發明專利。

關鍵字

TRIZ ； 集群分析 ； 陣列式電子元件 ； 底部填膠 ； 重工製程

並列摘要

The electronics packaging industry is moving towards higher density packages to increase product functionality. As for portable electronic products, solder joints that serve as interconnections between the component and the Printed Circuit Board (PCB) may crack due to mechanical stress such as drop, vibration, etc. Underfill encapsulant surrounding solder balls or solder bump help enhance products’ resistance to mechanical stress. The rework process is needed during occurrence of defects such as component NG, solder open, void in solder joint, incomplete underfill, underfill voiding and underfill overflow. It is difficult to rework because that most underfill is thermosetting polymer materials that is not easily softened after curing and the constraint of component and PCB withstand temperatures.
This study used Theory of inventive problem solving (TRIZ) to identify and solve problem related to the rework of underfilled component. In cause-effect and contradiction chain analysis (CECCA), sometimes user is lack of professional knowledge to select appropriate engineering parameters and cannot find the specific solution. This study proposed a two-stage cluster analysis integrated with the Ward’s method and K-means method to arrange the priority of inventive principles according to their occurrences in the contradiction matrix. Finally, the proposed contradiction matrix is applied to the case of rework process for the underfilled component. Results showed that the proposed contradiction matrix provide a better solution compared to the original contradiction matrix. In this case, additional solutions are generated, removing the electronic component with laser, the use of reworkable component socket and interchangeable Printed Circuit Board. All solutions are evaluated with their idealities. The interchangeable PCB appears the best and thus applied for an invention patents in Republic of China (ROC).

並列關鍵字

TRIZ ； Cluster analysis ； Area array electronics component ； Underfill ； Rework process

參考文獻

[2] 吳明學，自固接合螺帽產品設計及其塑性流動接合製程之研究，碩士論文，國立成功大學機械工程學系，台南，2010。

[13] 郭宇智，應用萃思工具解決封裝元件導線架脫層問題，碩士論文，國立清華大學工業工程與工程管理學系碩士在職專班，新竹，2008。

[5] 林傳傑，系統性創新理論與晶圓薄化技術之整合研究，博士論文，國立台灣大學機械工程學研究所，台北，2009。

[7] 洪嘉良、周志隆和王鴻康，「智慧卡系統的最適產品特徵組合：聯合分析之應用」，行銷評論，第六卷，第三期，2009，第449-474頁。

[1] 余強生和張育誠，「企業已採用與未採用電子市集的特徵：以集群分析法來探討」，電子商務研究，第三卷，第三期，2005，第265-288頁。