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  • 學位論文

環氧樹脂/陶瓷複材在晶片天線封裝之應用

Epoxy/Ceramics Composites Used as Chip Antenna Packageing Materials

指導教授 : 鄭國忠
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摘要


本研究首先利用環氧樹脂(DGEBA型)摻混含有鈦酸鋇陶瓷粉末及二氧化鈦、氧化鋅針狀粉末,以硬化劑- 4,4-methylene dianiline(MDA)及diethylene triamine(DETA)等混合,並製備晶片天線封裝材料,觀測其不同配方複材之介電性質(ε’)、玻璃轉移溫度(Tg)、熱裂解溫度及截面形態(morphology),發現介電常數隨陶瓷粉末含量增加而有所提升,其中加入70wt% Y5V煆燒後之陶瓷粉末,介電常數在頻率1GHz下,可以達到49 (ε’=49), 但tanδ較高(∼0.032),而複材配方介電性質之取得,可供微型天線封裝材料設計及製造之依據。此外,並利用平板式流變儀探討環氧樹脂添加鈦酸鋇陶瓷粉末之化學流變性質,研究環氧樹脂成形塑料硬化過程中,因化學變化而造成流體性質的改變,並瞭解流變特性之關係,藉由恆溫數據所求得參數,建立相關化學硬化流變模式,可作為加工設定之參考。 另外,應用美國REMCOM公司XFDTD時域有限差分套裝模擬軟體設計天線之結果,搭配多種環氧樹脂/陶瓷複材作為此晶片天線構裝體,藉由膠材澆注成型及介電材貼合方式達到封裝效果,並測量所封裝微小型晶片天線的反射損失S11及遠場輻射場型,實際測量天線之性能,發現天線封裝材天線中心頻率隨覆蓋之複材厚度或介電常數增加而下降,以D.E.R.331/MDA、D.E.R.331/MDA/24wt% NPO40M、膠片、LCP作為封裝材之天線,均符合802.11b、藍芽(2.400GHz~2.483GHz)商業規格。

並列摘要


DGEBA type epoxy resin, D.E.R. 331, was mixed with ceramic powders, BaTiO3, which has a high dielectric constant, acicular type titanium dioxide, or whisker zinc oxide; then the mixture was cured with 4,4’-methylene dianiline (MDA) or diethylenetriamine (DETA). It was found that the dielectric constant at high frequency, 1 GHz, increases with the solid content of fillers, such as BaTiO3. The epoxy composite with 70 wt% of calcined BaTiO3 has a high dielectric constant of about 49 measured at 1 GHz, and a loss factor of about 0.032. A four-parameter model was proposed to describe the chemorheology of the epoxy compound with filler during cure. Furthermore, the return loss S11 radiation patterns were measured to identify chip antenna performance. The effect center frequency decreases with the either thickness or dielectric constant of the encapsulant formed by the epoxy molding compound or ceramic. The antenna made by a copper cladded FR4 board, and packaged with D.E.R.331/MDA, D.E.R.331/MDA/ceramics, or LCP is satisfied with the specifications of IEEE 802.11 and bluetooth.

參考文獻


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被引用紀錄


郭怡江(2006)。天線封裝環氧樹脂複合材料之特性研究〔碩士論文,國立臺北科技大學〕。華藝線上圖書館。https://www.airitilibrary.com/Article/Detail?DocID=U0006-1008200612512900

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