含氧氮苯并環己烷聚合物熱性質研究

Synthesis and thermal property study of Polybenzoxazine

廖世灝(Shyh-Haw Liao)

指導教授 ： 張淑美

國立臺北科技大學/工程學院/有機高分子研究所/碩士(2007年)

摘要

由於電子系統要求信號傳播速度越來越快，電子元件的體積越來越小。以傳統的環氧樹脂為材料的印刷電路基板，對今日高性能需求的電子工業已無法滿足，開發高性能樹脂作為基板材料，為當務之急。含氧氮苯并環己烷聚合物，有著比環氧樹脂更良好的物理及機械性質，如玻璃轉移溫度(Tg)、低吸濕性、尺寸安定性、電氣性質等，其加熱開環產生芳香族氫氧基可應用為環氧樹脂硬化劑，改善上述物性，唯目前市售含氧含氮苯并環己烷聚合物之開環硬化溫度均偏高，影響加工速度，且較耗能。本研究針對含氧氮苯并環己烷聚合物及其搭配環氧樹脂後的開環硬化溫度及熱性質加以探討。實驗中合成以脂肪族二胺為主架構之含氧含氮苯并環己烷聚合物，發現其具有低溫開環功能，且摻配少量於現有商品中既有起始劑功效，本文中將市售商品與摻配型的含氧氮苯并環己烷聚合物，分別對環氧樹脂的開環硬化溫度及熱性質加以比較。

關鍵字

含氧氮苯并環己烷

並列摘要

Due to the rapid development of microelectronic systems, faster signal speed and smaller size are currently requested. To achieve those, a good quality of printed circuit board (PCB) is required, such as mechanical stability, high thermal stability and moisture inertness. Common used epoxy based PCB has not been satisfied due to the thermal stability issue. Therefore, to develop high performance material is very important.
To modify the PCB property, Polybenzoxazine is a good chose of curing agent due to its good physical and mechanical properties better than epoxy resin such as high glass transition temperature (Tg), low moisture absorption , good dimension stability、good electrical properties etc. In this work, a series of modified polybenzoxazine contained different chain length aliphatic group have synthesized and analyzed. Finally, PCB boards made from these synthesized polybenzoxazine and epoxy resin have been fabricated and showed better thermal and mechanical stability.

並列關鍵字

Polybenzoxazine

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