以無電鍍法製備BGA無鉛複合銲錫

Electroless Plating of Manufacturing Composite Pb-free Solder Joint In Ball Grid Array

黃克能(Ko-Neng Huang)

指導教授 ： 李文興

國立臺北科技大學/機電學院/製造科技研究所/碩士(2012年)

https://doi.org/10.6841/NTUT.2012.00653

摘要

本研究主要是以無電鍍錫法製作無鉛複合銲錫，並分析無鉛複合銲錫之機械性質，期望達到改善球格陣列構裝中之銲錫機械性質的目的。研究中是利用無電鍍錫法先在純鐵試片上分析無電鍍錫效果，找到最佳之無電鍍錫參數，再應用於直徑小於10μm的微小鐵粉上，經過無電鍍錫法後之鐵粉增加了對於無鉛銲錫材料（Sn3Ag0.5Cu）的親和性，利用此特性可製備成無鉛複合銲錫，再進一步製作成無鉛複合銲錫球，以探討添加微小Fe金屬顆粒對基材以及銲錫接點的微結構機械性質影響。研究結果顯示無電鍍錫法在純鐵試片上於溫度70℃時之無電鍍錫可以得到最緻密的表面，不易生成沉積物影響試片，反應速率適中不會使試片產生氧化，顯示浴溫70℃可以得到最佳的效果，而50℃和90℃相對來說有反應速率太慢導致試片氧化，以及反應過於劇烈使得沉積物快速增加的缺點。
接著將鐵粉顆粒使用無電鍍錫法鍍膜後，的確可以改善鐵粉和無鉛銲錫之間的親和性，可以讓鐵粉成功加入無鉛銲錫中製作成無鉛複合銲錫，進而達到散佈強化的效果，實驗數據顯示加入無電鍍鐵粉顆粒後之無鉛銲錫的抗剪強度和抗拉強度都隨著添加量增加而增加，顯示的確可以達到散佈強化的效果。

關鍵字

無電鍍錫 ； BGA ； 無鉛複合銲錫

並列摘要

In this study, mainly electroless tin plating method to manufacturing Pb-free composite solder, and analyze the mechanical properties of Pb-free composite solder, expected to achieve the purpose of improving the solder ball grid array package mechanical properties. Study is using the electroless tin plating method in the pure iron specimen to analysis the effect of electroless tin plating method, to find the best electroless tin plating parameters, and applied to a diameter less than 10μm tiny iron powder. The affinity for lead-free solder materials (Sn3Ag0.5Cu) increased after using electroless tin plating method. This feature can be manufacturing by a lead-free composite solder, further made into a lead-free composite solder ball, to explore the substrate and the microstructure of the solder joint mechanical properties by adding tiny Fe metal particles. The study results show that using electroless tin plating method on the pure iron specimen with temperature 70 ° C can be the densest surface, and it’s difficult to generate sediment impact specimen. Moderate reaction rate is not making the specimen oxidation, showing that bath temperature at 70 ℃ can get the best effect. Reaction rate is too slow to cause the specimen to oxidation at 50 ° C , and violent reaction makes the sediment increasing rapidly at 90 ° C, in the shortcomings.
The iron particles using the electroless plating Sn coating can improve the affinity between iron particles and lead-free solder. Adding the iron particles into the lead-free solder become the lead-free composite solder, to achieve the dispersion strengthening effect. The experimental data show that the plating iron particles of lead-free solder shear strength and tensile strength are increased with increasing dosage, showing the dispersion strengthening effect can be achieved.

並列關鍵字

Electroless plating ； BGA ； Composite Pb-free

參考文獻

[1] 陳昱章，BGA無鉛複合銲錫之機械性質，碩士論文，國立臺北科技大學製造科技研究所，台北，2010。

[21] H. D. Blair, T. Pan and J. M. Nicholson, Electronic Components andTechnology Conference, 1998, p.259.

[31] Yoshiharu Kariya and Masahisa Otsuka,Mechanical Fatigue Characteristics of

[22] D. Suh, D.W. Kim, P. Liu, H. Kim, J.A. Weninger, C.M. Kumar, A. Prasad,

[4] B. Trumble, J. Brydges, Technical progress on printed wired assemblyusing Nortel'sno-lead solder assembly process, IEEE International Symposium on Electronics & theEnvironment, 1998,pp. 112-116.