光熱老化行為對LED透明封裝材料與元件的影響之研究

LED封裝製程的研發材料多以環氧樹脂為首選，主要原因不外乎價格比起矽膠樹脂來說相對低廉且容易加工，同時能滿足LED封裝所需之晶片保護、提昇出光效能、高界面接著性及低成本等要求。但光熱安定性不佳的黃變情形目前仍無法改善。本研究目的是針對透明封裝材料應用在LED元件封裝製程，樣品的信賴性以及光學效能的穩定性影響研究，評估後將以六種不同樹脂配方進行測試。包含：甲基矽膠(配方1)、有機改質矽膠 (配方2)、脂環族環氧樹脂（配方3）雙酚A系環氧樹脂 (配方4)、矽氧烷改質環氧樹脂混成透明材料(配方5、6)。以此六個配方系統製備塊狀樣品和封裝SMD-LED，進行材料特性檢測、耐光熱安定性及量測光學效能，觀察其光衰變化。　　觀察樣品長時間在UVA照射及高溫熱儲放所產生的老化現象，發現在UVA照射後材料衰退的趨勢有規律性可循，但在經過熱儲放後所呈現出的老化曲線則較為複雜。另外，根據數據顯示樣品放置於高溫高濕環境下，吸濕性和光學特性的表現亦不一致。　　故在LED封裝材料選擇時，需要更長時間的檢測材料後續老化趨勢，並規劃其他測試方法，透過多方數據來深入探討影響封裝材料特性及發光衰退的各種因素，並制定出可靠性指標的實驗方法，才能建立更優異的LED封裝技術。

關鍵字

發光二極體；環氧樹脂；矽氧烷；透明封裝材料；光學效能；熱老化； UV老化

並列摘要

LED packaging process development materials with epoxy resin frist choose . Main reason is about epoxy cheaper price than Silicone and easy to process . While meeting the required chip LED package protection, enhance the optical performance , high interfacial adhesion and low cost requirements. However, poor thermal stability of light yellowing situation , currently there is no improvement. This study was aimed at transparent packaging materials used in LED packaging process elements, sample reliability and stability of the optical performance impact studies, assessment will be tested in six different resin systems. Include: Methyl silicone (System 1), organic modified silicone (System 2), an alicyclic epoxy resin (System 3) a bisphenol A epoxy resin (System 4), modified epoxy siloxane hybrid (System 5,6)transparent material. In this six formulations system, bulk sample and packaging SMD-LED preparation , for material properties testing, thermal stability and Optical Performance, observe the changes in the light fades. Samples are observed for a long time in the UVA irradiation and high temperature thermal arising from aging, found in the material after UVA irradiation with regularity to follow the trend of recession, but after high temperature thermal with showing the aging curve is more complicated. In addition, the data shows the sample placed in a Humidity (including hot/wet)environment, hygroscopic and optical properties of performance is not a contrast. Therefore, when the LED package material selection,require a longer time Observations the aging trend ,and plan for other testing methods, according to various data to more research and discussion , Impact packaging material properties and luminescence recession variety of factors, And to develop a reliability index of experimental methods in order to create more excellent LED packaging technology.

並列關鍵字

Light-Emitting Diode（LED）； packaging materials ； epoxy resin ； silicone ； Optical Performance ； Transparent Encapsulant

參考文獻

[1] R. Dupuis, M. Krames, J. Lightw. "History, Development, and Applications of High-Brightness Visible Light-Emitting Diodes," Journal of Lightwave Technology, vol. 26, no. 9, 2008, pp. 1154-1171

[2] J. You, N. Tran, Y. Lin, Y. He, F. Shi, "Phosphor-concentration dependent characteristics of white LEDs under different current regulation modes," J. Elec. Mater. vol. 38 no. 6, 2009, pp. 761-766

[5] C.F. Canto, A. De, L.A.S. Prado, E. Radovanovic, I.V.P. Yoshida, "Organic-inorganic hybrid materials derived from epoxy resin and polysiloxanes: synthesis and characterization," Polym. Eng. Sci. vol. 48, 2008, pp. 141-148

[6] S.T. Lin, S.K. Huang, "Synthesis and impact properties of siloxane-DCEBA epoxy copolymers," J. Polym. Sci. Part A: Polym. Chem. vol. 34, 1996, pp. 1907-1922

[7] S. Ma, W. Liu, Z. Wang, C. Hu, C. Tang, "Simultaneously Increasing Impact Resistance and Thermal Properties of Epoxy Resins Modified by Polyether-Grafted-Epoxide Polysiloxane," Polym.-Plastic Technol. Eng. vol. 49, 2010, pp. 467-473

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光熱老化行為對LED透明封裝材料與元件的影響之研究

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