高性能電子構裝之振動應力分析

The Vibration Stresses Analysis of High Performance Electronic Package

江孟儒(Meng-Ru Jiang)

指導教授 ： 陳永樹

元智大學/工程學院/機械工程學系/碩士(2000年)

摘要

近年來由於電子產業的蓬勃發展，促使電子資訊設備的研發皆朝輕薄短小設計及功能整合方向前進，造成電子構裝技術產生極大的改變。然而良好的電子構裝產品必須通過一系列的嚴格測試條件，以確保產品之良率及可靠性。因此本研究將針對BGA封裝體在隨機振動負載作用下的力學行為進行討論，其方法是利用建立理論變形受力模式與有限元素模擬等加以分析，並相互驗證其有效性。從文中研究結果顯示，在隨機振動之PSD曲線振動輸入的影響效應下，考慮振動模態之最大變形時，以模組最外側部位之錫球受力最大，此為引發錫球損毀的主要區域。而針對此種破壞之解決之道，則以抗振動加強肋於電路板之適當部分，使電路板的彎曲變形相對減小，因而模組內錫球的受力獲得有效地改善。因此，本研究討論的重點著重可能發生損毀之錫球部位作一可靠性的預測分析，且討論不同作用情況下錫球內所承受應力分佈情形，以作為BGA封裝設計時的參考。

關鍵字

電子構裝 ； 球柵陣列 ； 隨機振動 ； 功率譜密度 ； 加強肋 ； 應力 ； 錫球

並列摘要

The electronic products of today have higher performance and integrated functions but with smaller dimensions. This has forced the packaging technology to move toward miniature size and high packaging density. It is then important to assure their reliability due to the expensive unit cost. Vibration loading is one of the key issues other than thermal loading which affects the life of electronic product. The study discussed the dynamic stresses of BGA package system when subjected to a random vibration PSD input curve. A theoretical model for calculating the curvature of the deformed printed wiring board (PWB) on which the components are mounted was developed. Based on the equilibrium of the component solder ball forces, the stress levels for each solder ball is then derived. Finite element method to solve vibration stress of the solder balls is also presented for comparison. It is believed that this study provides a useful method for assuring the vibration reliability of BGA type electronic components at the circuit design stage.

並列關鍵字

Electronic Package ； BGA ； Random Vibration ； PSD ； Rib ； Stress ； Solder Ball

參考文獻

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