電子產品在產品製作的過程中,都會使用相關的測試儀器與設備來監測產品品質,而產品內部印刷電路板上的測試點即是方便機器檢測的關鍵點。如何將測試的涵蓋率提昇到最大,以及花費最少的製作費用,使整個製造與測試過程更有效率的執行,將是重要的議題,而此議題與組合性最佳化的問題有關。本論文研製之目的是期望對於印刷電路板的測試點規劃,以最大測試涵蓋率並且為最低價格為績效準則,以強化型混合免疫基因演算法與其他求解方法如基因演算法比較,嘗試以不同的參數與條件設定進行反覆驗證,結果證明強化型混合免疫基因演算法,確實能成為印刷電路板測試選取問題,可有效的計算與適切找出,接近最佳解的近似解的方法之一。
In the manufacture process of electronic products, some test facilities are usually used to monitor the quality of products. The test points on PCB (Printed Circuit Board) are the key issues to make the test procedure much easier. It’s important to achieve the maximum coverage rate with least costs for the selected test points on PCB. Therefore, the main purpose of this thesis focused on the way to select test points on PCB that can satisfy the criteria. We propose the Enhanced Hybrid Immune and Genetic Algorithm (EHIGA) to find the suitable test points on PCB. According to the experimental results, it shows that the proposed Enhanced Hybrid Immune and Genetic Algorithm can be used to find the test points on PCB effectively.