介電質電漿處理PFCs之系統開發

溫室效應所造成全球暖化現象將危及整個地球生態。由半導體廠所排放的全氟化合物(Perfluorocompounds, PFCs)，因具強紅外線吸收能力及極長的壽命，是造成溫室效應的兇手之一。目前已列為管制排放的氣體，但因為其化學結構穩定，在製程上不易由其他化學品替代。目前去除PFCs 的技術，大致以熱裂解及電漿分解為主。相較於熱裂解法，利用電漿去除PFCs 是一個低操作成本的方式。本研究是利用多管型介電質放電電極陣列，以常壓介電質放電原理來產生均勻的表面電漿，進而利用此種均勻的電漿解離氟化合物。本研究藉由改變電源的電壓、頻率，探討其對於解離程度的影響。結果顯示，利用多管型介電質放電電極陣列，可以產生均勻的表面冷電漿。實驗使用之分析儀器(RGA)測量結果再現性不好，破壞去除率的計算以多次實驗的平均結果表示。雖然數據不夠精確，但實驗顯示一致之趨勢。結果顯示當所施加的頻率與電壓提高時，則解離率也會隨之提高，得到最佳解離率約為50%。

關鍵字

溫室效應；全氟化合物；介電質放電

並列摘要

Global climate charge caused by greenhouse effects has been endangering the balance of ecosystem as well as the existence of creatures on earth. Due to its strong absorption of IR and long lifetime in the atmospheric, perfluorocompounds (PFCs), emitted from semi-conductor manufacturing process, is one of the fugitives for the greenhouse effects. PFCs have stable chemical structure and are hard to be replaced by other chemicals in the manufacturing process. Thermal decomposition and plasma decomposition are the major methods in the destruction and removal of PFCs. Plasma decomposition is a promising method due to its low operating cost and lost capital cost. Multiple dielectric electrode arrays is capable of generating homogeneous argon discharges by uniformly distributing gas with a filter plate. We expected it would destroy perfluorocompounds more effectively. In this study, we try to reach the optimal performance by tuning the charged voltage and frequency of the power. The result indicated that multiple dielectric electrode arrays are capable of generating homogeneous argon discharges by uniformly distributing. By increasing voltage and frequency, the destruction and removable rate of CF4 increase up around 50％. However, the accuracy of the experimental results was shadowed by the poor repeatability of the present RGA in our laboratory.

並列關鍵字

greenhouse effects ； Perfluorocompounds ； dielectric barrier discharge

參考文獻

何政昌，(2003)，「常壓電漿技術之研究」，國立成功大學化學工程研究所碩士論文

Babayan S.E., J.Y. Jeong, V.J. Tu, J. Park, G.S. Selwyn and R.F. Hicks, (1998) “Deposition of silicon dioxide films with an atmospheric-pressure plasma jet,” Plasma Sources Sci. Technol. 7

Babayan S.E., J.Y. Jeong, A. Schutze, V.J. Tu, M. Moravej, G.S. Selwyn and R.F. Hicks, (2001) “Deposition of silicon dioxide films with a non-equilibrium atmospheric-pressure plasma jet,” Plasma Sources Sci. Technol. 10

Bardos L. and H. Barankova, (2000) “Radio frequency hollow cathode source for large area cold atmospheric plasma applications,” Surface and Coating Technology

Chang, M. B., and C. C. Lee, (1995) “Destruction of formaldehyde with dielectric barrier discharge plasmas”, Environmental Science and Technology, Vol.29(1)

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介電質電漿處理PFCs之系統開發

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